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Smeets, E.M.J. (author), Bijnen, F.C.G. (author), Slabbekoorn, J. (author), Van Zeijl, H.W. (author)
In the MEMS world, increasing attention is being given to 3D devices requiring dual-sided processing. This requires lithography tools that are able to align a wafer to both its back side as front side. Overlay describes how well front and back side layers are positioned with respect to each other. Currently there is no simple and fast method to...
conference paper 2004
document
Wicaksono, D.H.B. (author), Pandraud, G. (author), French, P.J. (author)
This paper presents an on-going work to develop micromachined silicon-based strain sensor inspired from the campaniform sensillum of insects. We present simple optical setup for the characterisation of a membrane-in-recess structure as an early stage in mimicking the natural sensor. The microstructure is a 500 nm-thick SiO2/SiN circular membrane...
conference paper 2005
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Gurav, S.P. (author)
doctoral thesis 2005
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Pakula, L.S. (author), Rajaraman, V. (author), French, P.J. (author)
The operation principle, design, fabrication and measurement results of a quasi digital accelerometer fabricated on a thin silicon-on-insulator (SOI) substrate is presented. The accelerometer features quasi-digital output, therefore eliminating the need for analogue signal conditioning. The accelerometer can be directly interfaced to digital...
conference paper 2009
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Rajaraman, V. (author), Pakula, L.S. (author), Pham, H.T.M. (author), Sarro, P.M. (author), French, P.J. (author)
This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...
conference paper 2009
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Paalvast, S.L. (author)
The primary goal of this research was to study the feasibility of a thermal micro actuator for improved tracking performance of a Hard Disk Drive (HDD), and the feasibility of thermal actuation for precision micro motion and positioning in general. The fast dynamics of the micro actuator allows it to quickly correct position errors and thus...
doctoral thesis 2010
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Zaal, J.J.M. (author), Van Driel, W.D. (author), Zhang, G.Q. (author)
This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate...
journal article 2010
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Wei, J. (author)
High-precision manipulation of small-size objects is an attractive and challenging topic for both industrial production and fundamental scientific research. The capability of monitoring micro-samples during handling is essential to the accuracy and efficiency of a handling system for both liquid and solid samples. When handling liquid samples...
doctoral thesis 2010
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Hannot, S.D.A. (author)
Microsystems are very small sensors and actuators, manufactured with the same technology as computer chips. Well known applications of these machines are the acceleration sensors in the Wii game console and the iPhone. At the micrometer length scales of microsystems the physical forces behave different when compared to devices operating in the...
doctoral thesis 2010
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Mihailovic, M. (author)
This thesis explores the employment of monocrystalline silicon in microsystems as an active material for different thermal functions, such as heat generation and heat transfer by conduction. In chapter 1 applications that need thermal micro devices, micro heaters and micro heat exchangers, are briefly introduced. The shortcomings of commonly...
doctoral thesis 2011
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Shen, C. (author)
In this thesis we described a new approach to design, fabricate, package and test three silicon based porous vertical structures for nanoparticle separations. These vertical structures stand in between two microfluidic channels. In these walls nano channels that connect the two adjacent microchannels are embedded. Fluid and small particles can...
doctoral thesis 2011
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Estevez, P. (author), Bank, J. (author), Porta, M. (author), Wei, J. (author), Sarro, P.M. (author), Tichem, M. (author), Staufer, U. (author)
This paper presents the design, fabrication and characterization of a piezoresistive 6 Degrees of Freedom (DOF) force and torque sensor to be used in micro-manipulation. The mechanical structure of the device consists of 7 suspended beams and a calibration structure, which can be replaced by micro-manipulation tools such as micro-grippers or...
journal article 2011
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Yang, C.K. (author)
This thesis studies the effects of scaling on the characterisation and readout of micro-electro mechanical systems (MEMS) to nano-electro mechanical systems (NEMS). In particular it focuses on cantilever, which is a basic device building block and an important transducer in many sensing applications. This thesis presents an overview of major...
doctoral thesis 2012
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Zaal, J.J.M. (author)
The world has seen an unrivaled spread of semiconductor technology into virtually any part of society. The main enablers of this semiconductor rush are the decreasing feature size and the constantly decreasing costs of semiconductors. The decreasing costs of semiconductors in general are caused by the smaller feature size, the higher yield and...
doctoral thesis 2012
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Westra, H.J.R. (author)
In this Thesis, nonlinear dynamics and nonlinear interactions are studied from a micromechanical point of view. Single and doubly clamped beams are used as model systems where nonlinearity plays an important role. The nonlinearity also gives rise to rich dynamic behavior with phenomena like bifurcations, stochastic switching and amplitude...
doctoral thesis 2012
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Tian, J. (author)
The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging cost low. In this trend, unconventional devices ...
doctoral thesis 2013
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Gaitas, A. (author)
This dissertation aims to advance the current state of cantilevers with integrated metal thermal and deflection sensing elements. Metallic sensing elements enable the use of alternative substrate materials (such as polymers), that tend to exhibit higher compliance properties and are more robust (less brittle) compared to Si or Si3N4 cantilevers....
doctoral thesis 2013
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Kokorian, J. (author), Buja, F. (author), Van Spengen, W.M. (author)
In this paper, we present a new method for detecting in-plane displacements in microelectromechanical systems (MEMS) with an unprecedented sub-ångström accuracy. We use a curve-fitting method that is commonly employed in spectroscopy to find peak positions in a spectrum. We fit a function to the intensity profile of the image of a silicon beam...
journal article 2014
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Ye, H. (author)
Solid-State Lighting (SSL), powered by Light-Emitting Diodes (LEDs), is an energy-efficient technology for lighting systems. In contrast to incandescent lights which obtain high efficiency at high temperatures, the highest efficiency of LEDs is reached at low temperatures. The thermal management in LED product is then a key design parameter as...
doctoral thesis 2014
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Perez Garza, H.H. (author)
Properties of matter at the nano-scale may be very different from the ones observed at the macro-scale. The continuous variation of characteristics with diminishing size results in relevant changes in behavior. Similarly, these changes are caused by the rise of completely new phenomena (i.e. quantum confinement). Nanoscience can offer an...
doctoral thesis 2015
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