High-performance wafer-scale transfer-free graphene microphones

A repeatable method to fabricate multi-layer graphene (ML-gr) membranes of 2r = 85 - 155 μm (t < 10 nm) with a 100% yield on 100 mm wafers is demonstrated. These membranes show higher sensitivity than a commercial MEMS-Mic combined with an area reduction of 10x. The process overcomes one of the main limitations when integrating graphene...

Highly sensitive silicon Mach-Zehnder interferometer-based ultrasound sensor

We report a highly sensitive ultrasound sensor based on an integrated photonics silicon Mach-Zehnder interferometer (MZI). One arm of the MZI is located on a thin membrane, acting as the sensing part of the device. Ultrasound waves excite the membrane's vibrational mode, thus inducing modulation of the MZI transmission. The measured sensor...

Thin-Film Lithium Niobate Acoustic Delay Line Oscillators

In this work, thin-film lithium niobate (LiNbO₃) acoustic delay line (ADL) based oscillators are experimentally investigated for the first time for the application of single-mode oscillators and frequency comb generation. The design space for the ADL-based oscillator is first analyzed, illustrating that the key to low phase noise...

A MEMS Coriolis Mass Flow Sensing System with Combined Drive and Sense Interface

This paper describes an interface circuit for a MEMS Coriolis mass flow sensor that combines both drive and sense circuitry. The MEMS sensor consists of a suspended resonant tube, which is read-out by comb capacitors and driven into oscillation by current flowing through a drive coil in a magnet field. The interface circuit comprises a low...

MEMS enabled fast time-resolved X-ray diffraction characterization platform for copper nanoparticle sintering in heterogeneous integration applications

We report the design, fabrication and experimental investigation of a MEMS micro-hotplate (MHP) for fast time-resolved X-ray diffraction (TRXRD) study of Cu nanoparticle paste (nanoCu paste) sintering process. The device and its system are designed to have a 60 ms minimum time interval, uniform temperature distribution and variant gas...

High aspect ratio spiral resonators for process variation investigation and MEMS applications

In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the...

State space modeling of fluid flow for thrust control in mems-based micropropulsion

This paper presents a dynamic system approach for the modeling of fluid flow in microchannels to be used in thrust control applications. A micro-resistojet fabricated using MEMS (Microelectromechanical Systems) technology has been selected for the analysis. The device operates by vaporizing a liquid propellant, in this case water, and expelling...

Photonic hybrid assembly through flexible waveguides

Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...

On-chip positionable photonic waveguides for chip-to-chip optical interconnects

This paper reports on the progress related to a multichannel photonic alignment concept, aiming for sub-micrometer precision in the alignment of the waveguides of two photonic integrated circuits (PICs). The concept consists of two steps: chip-to-chip positioning and chip bonding provide a coarse alignment after which waveguide-to-waveguide...

Flow compensation in a MEMS dual-thermal conductivity detector for hydrogen sensing in natural gas

Conventional thermal conductivity detectors (TCDs) demonstrate a flow dependence. The approach presented here to reduce the flow dependence is based on the on-line flow compensation using two thin-film sensors on membranes in parallel on the same chip that are differentially operated. These are laterally identically, but with a different depth...

Robust Wafer-Level Thin-Film Encapsulation (Packaging) of Microstructures (MEMS) using Low Stress PECVD Silicon Carbide

This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...

SOI Digital Accelerometer Based on Pull-in Time Configuration

The operation principle, design, fabrication and measurement results of a quasi digital accelerometer fabricated on a thin silicon-on-insulator (SOI) substrate is presented. The accelerometer features quasi-digital output, therefore eliminating the need for analogue signal conditioning. The accelerometer can be directly interfaced to digital...

Simple optical characterisation for biomimetic micromachined silicon strain-sensing structure

This paper presents an on-going work to develop micromachined silicon-based strain sensor inspired from the campaniform sensillum of insects. We present simple optical setup for the characterisation of a membrane-in-recess structure as an early stage in mimicking the natural sensor. The microstructure is a 500 nm-thick SiO2/SiN circular membrane...

3D Align overlay verification using glass wafers

In the MEMS world, increasing attention is being given to 3D devices requiring dual-sided processing. This requires lithography tools that are able to align a wafer to both its back side as front side. Overlay describes how well front and back side layers are positioned with respect to each other. Currently there is no simple and fast method to...