High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...

Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation

This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting points of NFs and investigate the thermostability of NF. The Lindemann index and potential...

Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

The nanoindentation test was conducted in this paper to investigate the indentation hardness, plasticity and initial creep properties of pressure sintered nanosilver joint at various test temperatures. The effects of strain rate on the indentation hardness were first investigated. Then yield stress of nanosilver sintered joint was studied in...

A Reliability Prediction Methodology for LED Arrays

In this paper, a physics of failure-based prediction method is combined with statistical models to consider the impact of current crowding and current droop effects on the reliability of LED arrays. Electronic-thermal models of LEDs are utilized to obtain the operation conditions under the influences of current crowding and current droop. A...

Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received...

Stress analysis of pressure-assisted sintering for the double-side assembly of power module

Purpose: Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering processes. Design/methodology/approach: Three sintering sequences, S(a)...

Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

The microstructure, thickness, porosity, and shear performance of the silver (Ag) sintering layers under different sintering pressures were investigated. Experimental results demonstrated that the thickness and the porosity of the sintering layer decreased when the sintering pressure varied from 5 MPa to 30 MPa. This densification phenomenon...

A new hermetic sealing method for ceramic package using nanosilver sintering technology

High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There...

A stochastic process based reliability prediction method for LED driver

In this study, we present a general methodology that combines the reliability theory with physics of failure for reliability prediction of an LED driver. More specifically, an integrated LED lamp, which includes an LED light source with statistical distribution of luminous flux, and a driver with a few critical components, is considered. The...

Thermal Management on IGBT Power Electronic Devices and Modules

As an increasing attention towards sustainable development of energy and environment, the power electronics (PEs) are gaining more and more attraction on various energy systems. The insulated gate bipolar transistor (IGBT), as one of the PEs with numerous advantages and potentials for development of higher voltage and current ratings, has been...

A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

This work studies the effect of randomness of LED's lumen depreciation on reliability of the entire LED lamp. An integrated LED light bulb is selected as carrier of the proposed method. A PoF based lumen depreciation model and electronic-thermal simulations are introduced for reliability prediction. The normal distribution is used to describe...

Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers

This chapter investigates the reliability of the integrated LED lamps with electrolytic capacitor-less LED drivers. Firstly, the impact of the interaction between the degradations of the LED light source and the driver on the lumen depreciation is studied. The electronic-thermal simulation was carried out to obtain the history of temperatures of...

A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

In this paper, an integrated LED lamp with an electrolytic capacitor-free driver is considered to study the coupling effects of both LED and driver's degradations on lamp's lifetime. An electrolytic capacitor-less buck-boost driver is used. The physics of failure (PoF) based electronic thermal simulation is carried out to simulate the lamp's...

A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

This paper studies the interaction of catastrophic failure of the driver and LED luminous flux decay for an integrated LED lamp with an electrolytic capacitor-free LED driver. Electronic thermal simulations are utilized to obtain the lamp's dynamic history of temperature and current for two distinct operation modes: constant current mode (CCM...

A PoF and statistics combined reliability prediction for LED arrays in lamps

In this work, a physics-of-failure (PoF) reliability prediction methodology is combined with statistical models to consider the interaction between the lumen depreciation and catastrophic failures of LEDs. The current in each LED may redistribute when the catastrophic failure occurs in one of LEDs in an array, thus affecting the operation...