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Zaal, J.J.M. (author), Van Driel, W.D. (author), Zhang, G.Q. (author)
This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate...
journal article 2010