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Wei Chen, Chen (author), Cao, Dunhua (author), Dong, Yongjun (author), Xiong, Jingkang (author), Trofimov, Yuri (author), Lishik, Sergey (author), Zhang, Kouchi (author), Fan, J. (author)Y<sub>3</sub>Al<sub>5</sub>O<sub>12</sub>:Ce<sup>3+</sup> (YAG:Ce<sup>3+</sup>) single crystal phosphor (SCP) exhibits high internal quantum efficiency (IQE) and excellent thermal conductivity and stability. Such properties are promising in high-power laser-excited white lighting applications. However, YAG:Ce<sup>3+</sup> SCP usually shows...journal article 2022
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Wang, Shuo (author), Xu, Youkui (author), Wang, Qian (author), Zhou, Xufeng (author), Li, ZhenHua (author), Wang, Meng (author), Lei, Yutian (author), Zhang, Hong (author), Wang, H. (author), Jin, Zhiwen (author)Iodine vacancies and uncoordinated iodide ions of CsPbI<sub>3</sub> films are mainly responsible for nonradiative recombination. Here, we report a composition-engineering passivation method that through guanidium (GA<sup>+</sup>) and I<sup>−</sup> forms strong hydrogen bonds to passivate iodine vacancies and reduce defects. Both experimental...journal article 2022
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Zhang, X. (author), Valle Torre, M. (author), Specht, M.M. (author)Our life is surrounded by digital devices. Engineering education is one of the cornerstones in higher education for future generations and computational thinking (CT) is deemed as a core component in various engineering curricula. The Delft University of Technology (TU Delft), is the largest technical university in the Netherlands and computing;...conference paper 2022
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Lin, Yan (author), Qian, Chengduo (author), Shi, Jingtao (author), Zhang, Yuzhen (author), Ren, S. (author), Nan, Guozhi (author), Kong, Xiangjun (author), Fan, Weiyu (author)Compared with traditional asphalt, emulsified asphalt occurs to be a better low-temperature usability and environmental adaptability, which can reduce environmental pollution and energy consuming during road construction. The low-temperature ductility is a very important indicator to evaluate the environmental adaptability of emulsified asphalt....journal article 2022
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Li, Meng (author), Gao, Jianbo (author), Zhu, Liehuang (author), Zhang, Zijian (author), Lal, C. (author), Conti, M. (author), Alazab, Mamoun (author)Ride-Hailing Service (RHS) has drawn plenty of attention as it provides transportation convenience for riders and financial incentives for drivers. Despite these benefits, riders risk the exposure of sensitive location data during ride requesting to an untrusted Ride-Hailing Service Provider (RHSP). Our motivation arises from repetitive...journal article 2022
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Li, Meng (author), Gao, Jianbo (author), Zhang, Zijian (author), Fu, Chaoping (author), Lal, C. (author), Conti, M. (author)Shortest distance queries over large-scale graphs bring great benefits to various applications, i.e., save planning time and travelling expenses. To protect the sensitive nodes and edges in the graph, a user outsources an encrypted graph to an untrusted server without losing the query ability. However, no prior work has considered the user...conference paper 2022
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Flexible Collision-free Platooning Method for Unmanned Surface Vehicle with Experimental ValidationsDu, B. (author), Lin, Bin (author), Xie, Wei (author), Zhang, Weidong (author), Negenborn, R.R. (author), Pang, Y. (author)This paper addresses the flexible formation problem for unmanned surface vehicles in the presence of obstacles. Building upon the leader-follower formation scheme, a hybrid line-of-sight based flexible platooning method is proposed for follower vehicle to keep tracking the leader ship. A fusion artificial potential field collision avoidance...conference paper 2022
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Song, R. (author), Wen, Yuanqiao (author), Tao, Wei (author), Zhang, Qi (author), Papadimitriou, E. (author), van Gelder, P.H.A.J.M. (author)Ship behavior is the semantic expression of corresponding trajectory in spatial-temporal space. The intelligent identification of ship behavior is critical for safety supervision in the waterborne transport. In particular, the complicated behavior reflects the long-term intentions of a ship, but it is challenging to recognize it automatically...journal article 2022
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Chen, Wei (author), Chen, Ye (author), Cao, Yixing (author), Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical...journal article 2022
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Ji, Y. (author), Li, Ni (author), Cheng, Zhanming (author), Fu, Xiaoqian (author), Sun, Xiaoguang (author), Chowwanonthapunya, Thee (author), Zhang, Dawei (author), Ren, Jingli (author), Dey, P. (author), Dong, Chaofang (author)Corrosion jeopardizes the materials longevity and engineering safety, hence the corrosion rate needs to be forecasted so as to better guide materials selection. Although field exposure experiments are dependable, the prohibitive cost and their time-consuming nature make it difficult to obtain large dataset for machine learning. Here, we...journal article 2022
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Zhang, Qiang (author), Zhang, X. (author), Xu, Lei (author)Modelling slab track-bridge interaction subject to a moving train usually involves solving complex high-dimensional matrix equations which is time-consuming. This research works to optimize the auto-assembling process in the slab track-bridge coupling matrices formulation and improve the computational efficiency by truncating the dynamic...journal article 2022
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Liang, Jianwen (author), van der Maas, E.L. (author), Luo, Jing (author), Li, Xiaona (author), Chen, Ning (author), Adair, Keegan R. (author), Li, Weihan (author), Li, Junjie (author), Hu, Yongfeng (author), Liu, Jue (author), Zhang, Li (author), Zhao, W. (author), Parnell, S.R. (author), Ganapathy, S. (author), Wagemaker, M. (author)Understanding the relationship between structure, ionic conductivity, and synthesis is the key to the development of superionic conductors. Here, a series of Li<sub>3-3</sub><sub>x</sub>M<sub>1+</sub><sub>x</sub>Cl<sub>6</sub> (−0.14 < x ≤ 0.5, M = Tb, Dy, Ho, Y, Er, Tm) solid electrolytes with orthorhombic and trigonal structures are...journal article 2022
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Zhang, Hongzhi (author), He, Yanchen (author), Wang, Chuan (author), Guan, Yanhua (author), Ge, Zhi (author), Sun, Renjuan (author), Ling, Yifeng (author), Šavija, B. (author)Carbide residue activated blast furnace slag is a relatively new kind of eco-friendly construction materials. This work addresses the design of foamed lightweight concrete as road embankment material using such material. A statistical mixture design approach was adopted to assess the influence of each ingredient as well as the interaction...journal article 2022
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Ji, X. (author), van Ginkel, H.J. (author), Hu, D. (author), Schmidt-Ott, A. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to...conference paper 2022
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Martin, H.A. (author), Sattari, R. (author), Smits, E.C.P. (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...conference paper 2022
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Fan, Jiajie (author), Qian, Yichen (author), Chen, Wei (author), Jiang, Jing (author), Tang, Zhuorui (author), Fan, Xuejun (author), Zhang, Kouchi (author)A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...conference paper 2022
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Cui, Z. (author), Fan, X. (author), Zhang, Kouchi (author)In this paper, a 3D and fully coupled electromigration modeling is implemented using COMSOL. The fully coupled multi-physics theory has a unique set of partial differential equations, which cannot be directly simulated with the standard finite element software such as ABAQUS and ANSYS. With the weak form PDE modulus in COMSOL, the weak form of...conference paper 2022
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Wang, Xinyue (author), Zeng, Zejun (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...conference paper 2022
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van Ginkel, H.J. (author), Orvietani, M. (author), Romijn, J. (author), Zhang, Kouchi (author), Vollebregt, S. (author)In this work, a novel microfabrication-compatible production process is demonstrated and used to fabricate UV photoresistors made from ZnO nanoparticles. It comprises a simple room-temperature production method for synthesizing and direct-writing nanoparticles. The method can be used on a wide range of surfaces and print a wide range of...conference paper 2022
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Tan, C. (author), Wang, S. (author), Liu, X. (author), Jiang, Jing (author), Zhang, Kouchi (author), Ye, H. (author)On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...conference paper 2022