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Du, L. (author), Hu, D. (author), Poelm, René (author), van Driel, W.D. (author), Zhang, Kouchi (author)
The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However,...
conference paper 2023
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Hu, X. (author), Martin, H.A. (author), Poelma, René H. (author), Huang, J.L. (author), Rijckevorsel, H. (author), Scholten, H. (author), Smits, E.C.P. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Resin-reinforced silver (Ag) sintering material is an effective and highly reliable solution for power electronics packaging. The hybrid material’s process parameters strongly influence its microstructure and pose a significant challenge in estimating its effective properties as a thin interconnect layer. This research demonstrates a novel 3D...
conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
This paper reports the design and fabrication of a 4H-SiC CMOS readout circuit enabling monolithic integration of silicon carbide (SiC) sensors and circuits. Compared to conventional Si electronics, 4H-SiC integrated circuits can sustain operation in harsh conditions such as higher temperatures and radiation levels. The proposed amplifier...
conference paper 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...
conference paper 2023
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Tang, Zhuorui (author), Tian, Jing (author), Mao, Chaobin (author), Zhang, Nan (author), Huang, Jiyu (author), Fan, J. (author), Zhang, Kouchi (author)
Silicon carbide (SiC) epitaxial process is a key step in the fabrication of power devices, and the temperature field inside the reactor chamber plays an essential role in this process. In this paper, the temperature field in the horizontal chemical-vapor-deposition reactor chamber used for growing homo-epitaxial 4H-SiC material is studied using...
conference paper 2023
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Niu, Yunfan (author), Mo, J. (author), May, Alexander (author), Rommel, Mathias (author), Rossi, Chiara (author), Romijn, J. (author), Zhang, Kouchi (author), Vollebregt, S. (author)
This work presents the design and characterization of an analog-to-digital converter (ADC) with silicon carbide (SiC) for sensing applications in harsh environments. The SiC-based ADC is implemented with the state-of-the-art low-voltage SiC complementary-metal-oxide-semiconductor (CMOS) technology developed by Fraunhofer IISB. Two types of...
conference paper 2023
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Zhang, H. (author), Bueno Lopez, J. (author), Sberna, P.M. (author), Llombart, Nuria (author), Neto, A. (author)
Photoconductive antennas (PCAs) are promising candidates for sensing and imaging systems. We have investigated their properties under pulsed laser illumination both in transmission and reception. First, a transmitting PCA has been characterized including a power measurement. Then, a Quasi-Optical (QO) link between a transmitter and a receiver...
conference paper 2023
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Zhang, H. (author), Dabironezare, Shahab Oddin (author), Llombart, Nuria (author)
Lens based focal plane arrays (FPAs) with thousand elements are promising candidates for wide scanning sub-millimeter security imaging systems. To analyze such arrays, a field correlation approach is employed to design an FPA of quartz lenses coupled to a reflector. We consider quartz as the lens material due to its lower cost compared to...
conference paper 2023
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Zhang, Qinglong (author), Han, Rui (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)
Vision applications powered by deep neural networks (DNNs) are widely deployed on edge devices and solve the learning tasks of incoming data streams whose class label and input feature continuously evolve, known as domain shift. Despite its prominent presence in real-world edge scenarios, existing benchmarks used by domain adaptation methods...
conference paper 2023
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Wang, Yujie (author), Zhang, Qunfei (author), Ma, Shengqian (author), Zhang, Lingling (author), Han, Jing (author), Leus, G.J.T. (author)
Differential orthogonal signal-division multiplexing (OSDM) is attractive for underwater acoustic (UWA) communications because it can eliminate channel estimation, resulting in a substantial reduction of complexity at the receiver. However, when the channel is time-varying, it may suffer from serious inter-vector interference (IVI), which is...
conference paper 2023
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Zhang, Z. (author), Wang, Y. (author), Vuik, Cornelis (author), Hajibeygi, H. (author)
We present an efficient compositional framework for simulation of CO2 storage in saline aquifers with complex geological geometries during a lifelong injection and migration process. To improve the computation efficiency, the general framework considers the essential hydrodynamic physics, including hysteresis, dissolution and capillarity, by...
conference paper 2023
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Zhang, Xiaoyu (author), Li, Jianping (author), Chi, Po Wei (author), Chandrasegaran, R.S.K. (author), Ma, Kwan Liu (author)
With the most advanced natural language processing and artificial intelligence approaches, effective summarization of long and multi-topic documents - such as academic papers - for readers from different domains still remains a challenge. To address this, we introduce ConceptEVA, a mixed-initiative approach to generate, evaluate, and...
conference paper 2023
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Leibbrandt, Louise (author), Zhang, S. (author), Roelvink, M.A.T. (author), Bergkamp, Stan (author), Li, Xinqi (author), Bisschop, Lieselot (author), Wingerde, Karin van (author), Wang, H. (author)
This paper aims to understand to what extent the amount of drug (e.g., cocaine) trafficking per country can be explained and predicted using the global shipping network. We propose three distinct network approaches, based on topological centrality metrics, Susceptible-Infected-Susceptible spreading process and a flow optimization model of...
conference paper 2023
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Zhang, L. (author), Han, S. (author), Grammatico, S. (author)
In this paper, we propose a novel behavior planner that combines game theory with search-based planning for automated lane merging. Specifically, inspired by human drivers, we model the interaction between vehicles as a gap selection process. To overcome the challenge of multi-modal behavior exhibited by the surrounding vehicles, we formulate...
conference paper 2023
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Sun, B. (author), Mo, J. (author), Zhang, Hemin (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The...
conference paper 2023
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Mo, J. (author), Shankar, S. (author), Zhang, Kouchi (author), Vollebregt, S. (author)
Fabricating high-aspect-ratio (HAR) structures with silicon carbide (SiC) is a challenging task. This paper presents a silicon carbide (SiC) reinforced vertically aligned carbon nanotubes (VACNT) composite as a promising candidate to fabricate HAR MEMS devices for harsh environment applications. The use of a VACNT array allows the fast...
conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely...
conference paper 2023
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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)
As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...
conference paper 2023
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Zhang, Shuyu (author)
In the new media era, media architecture often serves as attractive urban spectacles and is widely represented and promoted on social media. Meanwhile, images and videos on social media also have an impact on the place identity and media architecture in the urban experience. This study argues that social media expands the conceptual scope of...
conference paper 2023
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Zhang, Y. (author), Mo, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author), May, Alexander (author), Erlbacher, Tobias (author)
The 4H-silicon carbide (SiC) exhibits excellent material characteristics, particularly in high-temperature, high-power, high-frequency applications. However, the reliability of SiC-based devices operating in harsh environments is a critical concern. While time-dependent dielectric breakdown (TDDB) in conventional SiC devices has been extensively...
conference paper 2023
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