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Ji, X. (author), van Ginkel, H.J. (author), Hu, D. (author), Schmidt-Ott, A. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to...conference paper 2022
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Martin, H.A. (author), Sattari, R. (author), Smits, E.C.P. (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...conference paper 2022
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Fan, Jiajie (author), Qian, Yichen (author), Chen, Wei (author), Jiang, Jing (author), Tang, Zhuorui (author), Fan, Xuejun (author), Zhang, Kouchi (author)A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...conference paper 2022
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Cui, Z. (author), Fan, X. (author), Zhang, Kouchi (author)In this paper, a 3D and fully coupled electromigration modeling is implemented using COMSOL. The fully coupled multi-physics theory has a unique set of partial differential equations, which cannot be directly simulated with the standard finite element software such as ABAQUS and ANSYS. With the weak form PDE modulus in COMSOL, the weak form of...conference paper 2022
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Wang, Xinyue (author), Zeng, Zejun (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...conference paper 2022
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van Ginkel, H.J. (author), Orvietani, M. (author), Romijn, J. (author), Zhang, Kouchi (author), Vollebregt, S. (author)In this work, a novel microfabrication-compatible production process is demonstrated and used to fabricate UV photoresistors made from ZnO nanoparticles. It comprises a simple room-temperature production method for synthesizing and direct-writing nanoparticles. The method can be used on a wide range of surfaces and print a wide range of...conference paper 2022
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Tan, C. (author), Wang, S. (author), Liu, X. (author), Jiang, Jing (author), Zhang, Kouchi (author), Ye, H. (author)On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...conference paper 2022
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Li, Shizhen (author), Liu, X. (author), Jiang, Jing (author), Tan, C. (author), Gao, Chenshan (author), Liu, Yang (author), Ye, H. (author), Zhang, Kouchi (author)Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...conference paper 2022
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Zhang, Xinglong (author), Peng, Yaoqian (author), Pan, W. (author), Xu, Xin (author), Xie, Haibin (author)Distributed model predictive control (DMPC) concerns how to online control multiple robotic systems with constraints effectively. However, the nonlinearity, nonconvexity, and strong interconnections of dynamic system models and constraints can make the real-time and real-world DMPC implementations nontrivial. Reinforcement learning (RL)...conference paper 2022
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Zhang, Ying (author), Janssen, M.F.W.H.A. (author)Government resources used for opening data and citizen engagement with open government data (OGD) are expected to have a mutual influence, but this has not been empirically investigated. Therefore, this paper investigates this mutual relationship by measuring both governmental resources and citizen engagement based on resource-based theory. The...conference paper 2022
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Romijn, J. (author), Vollebregt, S. (author), May, Alexander (author), Erlbacher, Tobias (author), van Zeijl, H.W. (author), Leijtens, J.A.P. (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)In this paper, we present a quadrant sun position sensor microsystem device in a silicon carbide technology that operates in a field-of-view of ±33° and reaches a mean error of 1.9° in this range. This will allow, for the first time, an inherently visible blind sun position sensor in a CMOS compatible technology. Opto-electronic integration of...conference paper 2022
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He, C. (author), Yang, Z. (author), Zhang, P. (author), Li, S. (author), Naeimi, M. (author), Li, Z. (author)Polygonal wear is a common type of damage on the railway wheel tread, which could induce wheel-rail impacts and further components failure. This study presents a finite element (FE) thermomechanical model to investigate the causes of wheel polygonal wear. The FE model is able to cope with three possible causes of polygonal wear: thermal...conference paper 2022
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Li, Meng (author), Zhang, Mingwei (author), Gao, Jianbo (author), Lal, C. (author), Conti, M. (author), Alazab, Mamoun (author)Location-Based Services (LBSs) depend on a Service Provider (SP) to store data owners’ geospatial data and to process data users’ queries. For example, a Yelp user queries the SP to retrieve the k nearest Starbucks by submitting her/his current location. It is well-acknowledged that location privacy is vital to users and several prominent...conference paper 2022
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Zhang, Feiran (author), Broz, F. (author), Dertien, Edwin (author), Kousi, Nefeli (author), Van Gurp, Jules A.M. (author), Ferrari, Oriana Isabella (author), Malagon, Ignacio (author), Barakova, Emilia I. (author)There is growing interest in psychological interventions using socially assistive robots to mitigate distress and pain in the pediatric population. This work seeks to address the deficit in understanding of what features and functionality young children and their parents desire to help with pain management by using co-design, a common...conference paper 2022
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Wang, Zhen (author), Shan, X. (author), Zhang, Xiangxie (author), Yang, J. (author)Current news datasets merely focus on text features on the news and rarely leverage the feature of images, excluding numerous essential features for news classification. In this paper, we propose a new dataset, N24News, which is generated from New York Times with 24 categories and contains both text and image information in each news. We use...conference paper 2022
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Band, Ruben (author), Lips, Maarten (author), Prawira, Julivius (author), van Schagen, Jurgen (author), Tulling, Simon (author), Zhang, Ying (author), Benaiss, Aicha A. (author), van der Ham, Ineke J.M. (author), Bueno Perez, M.R. (author), Bidarra, Rafael (author)In recent years, the use of Augmented and Virtual Reality (ARNR) has taken a larger role within training and education of various fields, but not every individual experiences the benefits that AR and VR technology are thought to provide. The perspective taking skill of an individual may be a good indicator of the effectiveness that AR and VR...conference paper 2022
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Ji, Liangzheng (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits...conference paper 2022
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Gao, Hanyan (author), Zhang, Jing (author), Zhu, Yingcan (author), Guo, Ruiqian (author), Zhang, Wanlu (author), Zhang, Kouchi (author), Liu, Pan (author)With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...conference paper 2022
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Chen, Haixue (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)Nanosilver pastes have been regarded as the most promising die-attach materials for high-temperature and high-power applications due to their advantages such as excellent thermal conductivity, electrical conductivity, high temperature resistance, and good shear strength. However, the common hot pressing sintering process for nanosilver pastes...conference paper 2022
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Li, Xiao (author), Tang, Jiuyang (author), Zhao, Jiayan (author), Li, Jinbing (author), Zhang, Kouchi (author), Liu, Pan (author)With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a...conference paper 2022