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Gaio, N. (author), Waafi, A. (author), Vlaming, M.L.H. (author), Boschman, E. (author), Dijkstra, P. (author), Nacken, O. (author), Braam, S.R. (author), Boucsein, C. (author), Sarro, Pasqualina M (author), Dekker, R. (author)This work presents the first multi-well plate that allows for simultaneous mechanical stimulation and electrical monitoring of multiple in-vitro cell cultures in parallel. Each well of the plate is equipped with an Organ-on-Chip (OOC) device consisting of a stretchable micro-electrode array (MEA). For the first time, a film assisted molding ...conference paper 2018
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Huang, Z.Q. (author), Poelma, René H. (author), Vollebregt, S. (author), Koelink, M.H. (author), Boschman, E. (author), Kropf, R. (author), Gallouch, M. (author), Zhang, Kouchi (author)This article shows the fabrication process and packaging of through polymer optical vias (TPOV). The TPOV enables encapsulation and packaging of silicon photonic systems using film assisted molding (FAM) and the creation of micron-sized through polymer optical vias. The optical vias are lithographically defined in thick film photo-resist (∼ 300...conference paper 2018