Searched for: author:"Chen, Xianping"
(1 - 6 of 6)
document
Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, G.Q. (author)
Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...
conference paper 2018
document
Cui, Z. (author), Zhang, Yingying (author), Yang, Qun (author), Zhang, G.Q. (author), Chen, Xianping (author)
Interfacial properties of Cu/SiO<sub>2</sub> in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO<sub>2</sub>. The...
conference paper 2018
document
Cai, Miao (author), Yang, Daoguo (author), Huang, J. (author), Zhang, Maofen (author), Chen, Xianping (author), Liang, Caihang (author), Koh, S.W. (author), Zhang, G.Q. (author)
The color coordinate shift of light-emitting diode (LED) lamps is investigated by running three stress-loaded testing methods, namely step-up stress accelerated degradation testing, step-down stress accelerated degradation testing, and constant stress accelerated degradation testing. A power model is proposed as the statistical model of the...
journal article 2017
document
Tang, H. (author), Ye, H. (author), Wong, K.Y. (author), Leung, Stanley Y.Y. (author), Fan, Jiajie (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, G.Q. (author)
The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the...
journal article 2017
document
Ye, H. (author), Leung, Stanley Y.Y. (author), Wong, K.Y. (author), Chen, Xianping (author), Lin, Kai (author), Fan, J. (author), Kjelstrup, Signe (author), Fan, Xuejun (author), Zhang, G.Q. (author)
Using the analogue of the electric inductance, we reveal the properties of the thermal inductance in GaN-based light-emitting diode devices by testing their transient thermal behaviors. We find that the devices exhibit a transient thermal response under step-down or step-up currents and observe notable inductive phenomena of the temperature...
journal article 2016
document
Chen, Xianping (author), Ye, H. (author), Fan, Xuejun (author), Ren, Tianling (author), Zhang, G.Q. (author)
Heat pipes (HPs) have received considerable attention in recent decades, especially in the field of cooling electronics, which requires the removal of added heat from an area of limited volume to the environment. Small HPs are widely used in electronic applications, which are normally limited by the compact structure and dimensions of the...
journal article 2016
Searched for: author:"Chen, Xianping"
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