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Mohammadi, Majid (author), Tamburri, Damian A. (author), Rezaei, J. (author)Priorities in multi-criteria decision-making (MCDM) convey the relevance preference of one criterion over another, which is usually reflected by imposing the non-negativity and unit-sum constraints. The processing of such priorities is different than other unconstrained data, but this point is often neglected by researchers, which results in...journal article 2023
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Zampetti, Fiorelli (author), Tamburri, Damian A. (author), Panichella, Sebastiano (author), Panichella, A. (author), Di Penta, Massimiliano (author), Canfora, Gerardo (author)Continuous Integration and Delivery (CI/CD) practices have shown several benefits for software development and operations, such as faster release cycles and early discovery of defects. For Cyber-Physical System (CPS) development, CI/CD can help achieving required goals, such as high dependability, yet it may be challenging to apply. This...journal article 2022
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Tamburri, Damian A. (author), Palomba, F. (author), Serebrenik, Alexander (author), Zaidman, A.E. (author)“There can be no vulnerability without risk; there can be no community without vulnerability; there can be no peace, and ultimately no life, without community.” - [M. Scott Peck]<br/><br/>The open-source phenomenon has reached the point in which it is virtually impossible to find large applications that do not rely on it. Such grand adoption may...journal article 2019
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Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author)We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...conference paper 2016