Searched for: author%3A%22Fan%2C+X.%22
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...
journal article 2024
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Guo, Baotong (author), Wen, Minzhen (author), Tang, Hongyu (author), Lishik, Sergey (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
MAlSiN<sub>3</sub>:Eu<sup>2+</sup> (M = Ca, Sr) is commonly used in high-power phosphor-converted white-light-emitting diodes and laser diodes to promote their color-rendering index. However, the wide application of this phosphor is limited by the degradation of its luminescent properties in high-temperature, high-humidity, and high-sulfur...
journal article 2024
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Persello, Claudio (author), Grift, Jeroen (author), Fan, X. (author), Paris, Claudia (author), Hansch, Ronny (author), Koeva, Mila (author), Nelson, Andrew (author)
Agricultural field polygons within smallholder farming systems are essential to facilitate the collection of geo-spatial data useful for farmers, managers, and policymakers. However, the limited availability of training labels poses a challenge in developing supervised methods to accurately delineate field boundaries using Earth observation ...
journal article 2023
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Chen, Wei (author), Yan, Xuyang (author), Ibrahim, Mesfin S. (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...
conference paper 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)
This paper presented integrated electromigration (EM) studies through experiment, theory, and simulation. First, extensive EM tests were performed using Blech and standard wafer-level electromigration acceleration test (SWEAT)-like structures, which were fabricated on four-inch wafers. Second, a molecular dynamics (MD) simulation-based...
journal article 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)
This paper presented a comprehensive experimental and simulation study for thermomigration (TM) accompanying electromigration (EM) at elevated current densities. Both Blech and standard wafer-level electromigration acceleration test (SWEAT)-like test structures, with aluminum (Al) as a carrier, were used for testing and analysis. In Part I of...
journal article 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Kouchi (author)
In this paper, we apply the Eshelby's solution to study the effect of passivation layer on electromigration (EM) failure in a conductor. The passivation layer is considered as an elastic material, not a rigid layer anymore. Thus, the deformation and stress evolution in the conductor during EM are related to the mechanical property of the...
conference paper 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...
journal article 2023
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Jiang, Jing (author), Chen, Wei (author), Qian, Yichen (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...
journal article 2023
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Ye, G. (author), Fan, X. (author), Zhang, Kouchi (author)
In this paper, we presented several practical aspects for building robust and reliable finite element models in thermomechanical modeling in electronics packaging using finite element analysis. Firstly, for layered or patterned structures, a homogenized equivalent model, with equivalent orthotropic material properties, gives excellent...
journal article 2022
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van Driel, W.D. (author), Yazdan Mehr, M. (author), Fan, X. J. (author), Zhang, Kouchi (author)
In the foregoing chapters, the reliability of organic compounds in microelectronics and optoelectronics was discussed. It provided a state of the art in reliability concepts for materials used in electronic products. It also enlightened the direction in reliability concepts for these products. In this chapter, we discuss the outlook where we...
book chapter 2022
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Cui, Z. (author), Fan, X. (author), Zhang, Kouchi (author)
In this paper, a 3D and fully coupled electromigration modeling is implemented using COMSOL. The fully coupled multi-physics theory has a unique set of partial differential equations, which cannot be directly simulated with the standard finite element software such as ABAQUS and ANSYS. With the weak form PDE modulus in COMSOL, the weak form of...
conference paper 2022
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Ye, Guigen (author), Fan, X. (author), Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), Zhang, Kouchi (author)
In this paper, stability and mechanistic simulations for a four-beam-mass-based MEMS gravimeter were conducted, and guidelines for the gravimeter design were proposed. Based on a prototyped MEMS device, the nonlinear finite element model was validated first against the experimental results. Then, we demonstrated three different scenarios in...
journal article 2022
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Cui, Z. (author), Zhang, Y. (author), Hu, D. (author), Vollebregt, S. (author), Fan, J. (author), Fan, X. (author), Zhang, Kouchi (author)
Understanding the atomic diffusion features in metallic material is significant to explain the diffusion-controlled physical processes. In this paper, using electromigration experiments and molecular dynamic (MD) simulations, we investigate the effects of grain size and temperature on the self-diffusion of polycrystalline aluminium (Al). The...
journal article 2022
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Tang, H. (author), Gao, Chenshan (author), Yang, Huiru (author), Sacco, L.N. (author), Sokolovskij, R. (author), Ye, H. (author), Vollebregt, S. (author), Fan, X. (author), Zhang, Kouchi (author)
In this paper, tin oxidation (SnO x )/tin-sulfide (SnS) heterostructures are synthesized by the post-oxidation of liquid-phase exfoliated SnS nanosheets in air. We comparatively analyzed the NO2 gas response of samples with different oxidation levels to study the gas sensing mechanisms. The results show that the samples oxidized at 325 °C are...
journal article 2021
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Qian, Yichen (author), Hou, F. (author), Fan, J. (author), Lv, Quanya (author), Fan, X. (author), Zhang, Kouchi (author)
A new panel-level silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) power module was developed by using the fan-out and embedded chip technologies. To achieve the more effective thermal management and higher reliability under thermal cycling, a new optimization method called Ant colony optimization-back...
journal article 2021
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Fan, J. (author), Chen, Wei (author), Yuan, Weiyi (author), Fan, X. (author), Zhang, Kouchi (author)
Light-emitting diode (LED) arrays have attracted increased attention in the area of high power intelligent automotive headlamps because of their superiority in disposing of the power limit of an individual LED package and controllably luminous intensity and illumination pattern. The optical and chromatic performances of an LED array do not...
journal article 2020
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Fan, J. (author), Li, Yutong (author), Fryc, Irena (author), Qian, C. (author), Fan, X. (author), Zhang, Kouchi (author)
The full-spectrum white light-emitting diode (LED) emits light with a broad wavelength range by mixing all lights from multiple LED chips and phosphors. Thus, it has great potentials to be used in healthy lighting, high resolution displays, plant lighting with higher color rendering index close to sunlight and higher color fidelity index. The...
journal article 2020
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Rao, J. W. (author), Wang, Y. P. (author), Yang, Y. (author), Yu, T. (author), Gui, Y. S. (author), Fan, X. (author), Xue, D. S. (author), Hu, C. M. (author)
We systematically study the indirect interaction between a magnon mode and a cavity photon mode mediated by traveling photons of a waveguide. From a general Hamiltonian, we derive the effective coupling strength between two separated modes, and obtain the theoretical expression of the system's transmission. Accordingly, we design an...
journal article 2020
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Hu, D. (author), Cui, Z. (author), Fan, J. (author), Fan, X. (author), Zhang, Kouchi (author)
A molecular dynamics (MD) simulation was performed on the coalescence kinetics and mechanical behavior of the pressure-assisted Cu nanoparticles (NPs) sintering at low temperature. To investigate the effects of sintering pressure and temperature on the coalescence of the nanoparticles, sintering simulations of two halve Cu NPs were conducted at...
journal article 2020
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