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Wen, Minzhen (author), Guo, Baotong (author), Chen, Shanghuan (author), Hu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The (Ca, Sr) AlSiN₃:Eu²⁺(CSASN:Eu) red phosphor is widely used to improve color rendering of high-power phosphor-converted lighting diode (pc-WLED), but it is always unstable under high temperature and high humidity environments. Therefore, the studies on the temperature and humidity resistance of red phosphors and their aging mechanism have...conference paper 2023
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Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author)This paper investigates thermomigration (TM) and electromigration (EM) in SWEAT structure. Firstly, the distribution of temperature along SWEAT structure during EM is obtained by using finite element (FE) simulation. The FE simulation results show that the temperature is almost uniformly distributed in the most region of narrow line in SWEAT...conference paper 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...conference paper 2023
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Li, Shizhen (author), Liu, Yang (author), Ye, H. (author), Liu, X. (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting points of NFs and investigate the thermostability of NF. The Lindemann index and potential...journal article 2022
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Chen, Wei (author), Chen, Ye (author), Cao, Yixing (author), Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical...journal article 2022
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Fan, Jiajie (author), Qian, Yichen (author), Chen, Wei (author), Jiang, Jing (author), Tang, Zhuorui (author), Fan, Xuejun (author), Zhang, Kouchi (author)A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...conference paper 2022
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Qian, Cheng (author), Gu, Tijian (author), Wang, Ping (author), Cai, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates and temperatures, and established the constitutive models. First, 50...journal article 2022
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Feng, Shuo (author), Jiang, Tao (author), Chen, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to reach a white color. However, (Ca,Sr)AlSiN 3 :Eu 2+ (CSASN) red...conference paper 2022
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Fan, Jiajie (author), Jiang, Dawei (author), Zhang, Hao (author), Hu, D. (author), Liu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author)Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...journal article 2022
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Yuan, Cadmus (author), Fan, Xuejun (author), Zhang, Kouchi (author)Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation capability against the design and process...journal article 2021
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Hu, D. (author), Gu, Tijian (author), Cui, Z. (author), Vollebregt, S. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)In high power electronics packaging, sintered silver nanoparticle joints suffer from thermal-humidity- electrical-chemical joint driven corrosion in extreme environments. In this paper, we conducted aging tests on sintered silver nanoparticles under high-temperature, high-humidity, and high-sulphur conditions. The results show that: (1) the...journal article 2021
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Fan, J. (author), Jing, Zhou (author), Cao, Yixing (author), Ibrahim, Mesfin Seid (author), Li, Min (author), Fan, Xuejun (author), Zhang, Kouchi (author)With their advantages of high efficiency, long lifetime, compact size and being free of mercury, ultraviolet light-emitting diodes (UV LEDs) are widely applied in disinfection and purification, photolithography, curing and biomedical devices. However, it is challenging to assess the reliability of UV LEDs based on the traditional life test or...journal article 2021
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Ibrahim, Mesfin Seid (author), Fan, J. (author), Yung, Winco K.C. (author), Jing, Zhou (author), Fan, Xuejun (author), van Driel, W.D. (author), Zhang, Kouchi (author)The increased system complexity in electronic products brings challenges in a system level reliability assessment and lifetime estimation. Traditionally, the graph model-based reliability block diagrams (RBD) and fault tree analysis (FTA) have been used to assess the reliability of products and systems. However, these methods are based on...journal article 2021
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Cui, Z. (author), Fan, J. (author), van Ginkel, H.J. (author), Fan, Xuejun (author), Zhang, Kouchi (author)The CaAlSiN<sub>3</sub>:Eu<sup>2+</sup> red phosphor and its silicone/phosphor composite are very promising materials used in the high color rendering white light-emitting diode (LED) packaging. However, the reliabilities of CaAlSiN<sub>3</sub>:Eu<sup>2+</sup> and its composite are still being challenged by phosphor hydrolysis at high...journal article 2020
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Hou, F. (author), Zhang, Hengyun (author), Huang, Dezhu (author), Fan, J. (author), Liu, Fengman (author), Lin, Tingyu (author), Cao, Liqiang (author), Fan, Xuejun (author), Ferreira, Braham (author), Zhang, Kouchi (author)In this article, a microchannel thermal management system (MTMS) with the two-phase flow using the refrigerant R1234yf with low global warming potential is presented. The thermal test vehicles (TTVs) were made of either single or multiple thermal test chips embedded in the substrates, which were then attached to the MTMS. The system included...journal article 2020
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Tang, H. (author), Sacco, L.N. (author), Vollebregt, S. (author), Ye, H. (author), Fan, Xuejun (author), Zhang, Kouchi (author)2D and nanostructured metal sulfide materials are promising in the advancement of several gas sensing applications due to the abundant choice of materials with easily tunable electronic, optical, physical, and chemical properties. These applications are particularly attractive for gas sensing in environmental monitoring and breath analysis....review 2020
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Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author)In this paper, a recently developed theory - general coupling model of electromigration, is implemented in ANSYS. We first identify several errors provided in ANSYS manual for electromigration modeling. Then the general coupling model is implemented in ANSYS and the detailed description is presented. Finally, a 1-D confined metal line with a...conference paper 2020
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Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Xuejun (author), Zhang, Kouchi (author)The nanoindentation test was conducted in this paper to investigate the indentation hardness, plasticity and initial creep properties of pressure sintered nanosilver joint at various test temperatures. The effects of strain rate on the indentation hardness were first investigated. Then yield stress of nanosilver sintered joint was studied in...journal article 2019
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Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Jiajie (author), Placette, Mark D. (author), Fan, Xuejun (author), Zhang, Kouchi (author)Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received...journal article 2019
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Liu, Y. (author), Zhang, H. (author), Wang, Lingen (author), Fan, Xuejun (author), Zhang, Kouchi (author), Sun, Fenglian (author)Purpose: Crack and stress distribution on dies are key issues for the pressure-assisted sintering bonding of power modules. The purpose of this research is to build a relationship among stress distributions, sintering sequences and sintering pressures during the sintering processes. Design/methodology/approach: Three sintering sequences, S(a)...journal article 2019