Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation

Patterning of fine-features in nanoporous films synthesized by spark ablation

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study

Effects of Defect and Temperature on the Mechanical Performance of WS₂: A Multiscale Analysis

The JOREK non-linear extended MHD code and applications to large-scale instabilities and their control in magnetically confined fusion plasmas

Low power AlGaN/GaN MEMS pressure sensor for high vacuum application

Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study