Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study

As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...