Pressure-assisted CU sintering for SiC Die-attachment application

A facile method to prepare oriented boron nitride-based polymer composite with enhanced thermal conductivity and mechanical properties

Hexagonal boron nitride (BN) is often used as filler to improve the thermal conductivity of polymer matrix due to its high thermal conductivity. However, previously reported BN-based composites always have a high in-plane thermal conductivity, which is not beneficial for vertical heat dissipation. In addition, high BN content results in the...