Searched for: author:"Poelma, R.H."
(1 - 5 of 5)
document
Silvestri, C. (author), Riccio, M. (author), Poelma, R.H. (author), Morana, B. (author), Vollebregt, S. (author), Santagata, F. (author), Irace, A. (author), Zhang, G.Q. (author), Sarro, P.M. (author)
Thermal material properties play a fundamental role in the thermal management of microelectronic systems. The porous nature of carbon nanotube (CNT) arrays results in a very high surface area to volume ratio, which makes the material attractive for surface driven heat transfer mechanisms. Here, we report on the heat transfer performance of...
journal article 2016
document
Poelma, R.H. (author)
This thesis describes a series of experiments and fabrication methods on high-aspect-ratio 3D microstructures for wafer level packaging and 3D heterogeneous system integration (3D-HSI) using novel materials such as carbon nanotubes and thick-film photo-resists. Furthermore, theoretical and experimental research efforts are made to understand the...
doctoral thesis 2016
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Poelma, R.H. (author), Morana, B. (author), Vollebregt, S. (author), Schlangen, H.E.J.G. (author), Van Zeijl, H.W. (author), Fan, X. (author), Zhang, G.Q. (author)
The porous nature of carbon nanotube (CNT) arrays allows for the unique opportunity to tailor their mechanical response by the infiltration and deposition of nanoscale conformal coatings. Here, we fabricate novel photo-lithographically defined CNT pillars that are conformally coated with amorphous silicon carbide (a-SiC) to strengthen the...
journal article 2014
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Poelma, R.H. (author), Van Zeijl, H. (author), Zhang, G. (author)
The invention relates to vias for three dimensional (3D) stacking, packaging and heterogeneous integration of semi-conductor layers and wafers. In particular, the invention relates to a process for the manufacture of a via, to a via, to a 3D circuit and to a semiconductor device. Vias are interconnects used to vertically interconnect chips,...
patent 2014
document
Wong, C.K.Y. (author), Leung, S.Y.Y. (author), Poelma, R.H. (author), Jansen, K.M.B. (author), Yuan, C.C.A. (author), Van Driel, W.D. (author), Zhang, G. (author)
Atomistic coarse grained parameters were calculated from a non-equilibrium molecular dynamics simulation of the separation of an epoxy-copper interface. The methodology to determine the interaction energy and the equilibrium distance between the interfacial materials at a minimum energy is established. The traction-displacement relations of the...
journal article 2012
Searched for: author:"Poelma, R.H."
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