Searched for: author%3A%22Sarro%2C+P.M.%22
(1 - 5 of 5)
document
Wei, J. (author), Ye, H. (author), Van Zeijl, H.W. (author), Sarro, P.M. (author), Zhang, G.Q. (author)
A micro-electro-mechanical-system (MEMS) based, temperature triggered, switch is developed as a cost-effective solution for smart cooling control of solid-state-lighting systems. The switch (1.0x0.4 mm2) is embedded in a silicon substrate and fabricated with a single-mask 3D micro-machining process. The device switches on at a designed...
journal article 2012
document
Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Maury, P. (author), Sarro, P.M. (author)
Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and...
journal article 2010
document
Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Sarro, P.M. (author)
Lithography as developed for IC device fabrication is a high volume high accuracy patterning technology with strong 2 dimensional (2D) characteristics. This 2D nature makes it a challenge to integrate this technology in a 3 dimensional (3D) manufacturing environment. This article addresses the performance of a waferstepper (ASML PAS5000) in...
journal article 2010
document
Van Zeijl, H.W. (author), Sarro, P.M. (author)
journal article 2010
document
Paalvast, S.L. (author), Van Zeijl, H.W. (author), Su, J. (author), Sarro, P.M. (author), Van Eijk, J. (author)
journal article 2007
Searched for: author%3A%22Sarro%2C+P.M.%22
(1 - 5 of 5)