MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis

The majority of Integrated Circuit (IC) devices are encapsulated in wire-bonded plastic IC packages. Epoxy molding compound is used as the encapsulation material and gold was used as the bonding wire material. However, the increase of gold material price from 400 USD/ounce in year 2005 to 1400 USD/ounce in year 2013 results in a major cost issue...