Wafer-level direct bonding of optimized superconducting NbN for 3D chip integration

3D integration has well-developed for traditional CMOS technology operating at room temperature, but few studies have been performed for cryogenic applications such as quantum computers. In this paper, a wafer-to-wafer bonding of superconductive joints based on niobium nitride (NbN) is performed to demonstrate the possibility of 3D...

Analysis of polydihydrosilane crystallization by excimer laser annealing

Printing of electronics has been gaining a lot of attention over the past decade as a low cost alternative to conventional electronic fabrication methods. A significant development in this area was the possibility to print a silicon precursor, polydihydrosilane, which can directly be transformed into polycrystalline silicon by an excimer laser...

Solution-Based Fabrication of Polycrystalline Si Thin-Film Transistors from Recycled Polysilanes

Currently, research has been focusing on printing and laser crystallization of cyclosilanes, bringing to life polycrystalline silicon (poly-Si) thin-film transistors (TFTs) with outstanding properties. However, the synthesis of these Sibased inks is generally complex and expensive. Here, we prove that a polysilane ink, obtained as a byproduct of...

Solution-based polycrystalline silicon transistors produced on a paper substrate

Printing of electronics is pursued as a low-cost alternative to conventional manufacturing processes. In addition, owing to relatively low process temperatures, flexible substrates can be used enabling novel applications. Among flexible substrates, paper was found to be a particularly interesting candidate, since it has an order of magnitude...

Liquid Silicon for Printed Polycrystalline Silicon Thin-Film Transistors on Paper

Low-temperature formation of silicon and silicon oxide structures

A method for low-temperature formation of a silicon/silicon-oxide structure on a substrate is described wherein the method comprises: forming a first (poly)silane layer over at least part of a substrate; transforming said first (poly)silane layer directly into a (crystalline) silicon layer by exposing said first (poly)silane layer to UV...

Solution-processed polycrystalline silicon on paper

Printing electronics has led to application areas which were formerly impossible with conventional electronic processes. Solutions are used as inks on top of large areas at room temperatures, allowing the production of fully flexible circuitry. Commonly, research in these inks have focused on organic and metal-oxide ink materials due to their...

Method of forming silicon on a substrate

A method for forming a silicon layer using a liquid silane compound is described wherein said method comprises the steps of forming a first layer on a substrate, preferably a flexible substrate, said first layer comprising a (poly)silane; and, irradiating said first light ight comprising one or more wavelength within the range between 200 and...

Single-Grain Si TFTs Fabricated on a Precursor from Doctor-Blade Coated Liquid-Si

Printing is attractive for manufacturing flexible circuits. This manuscript presents our investigation of single-grain Si TFTs fabricated from printed liquid-Si, on a polyimide substrate with the maximum process temperature of 350 °C. The field-effect mobility is 460 cm2/Vs for electrons and 121 cm2/Vs for the holes. CMOS inverters were also...

Manufacturing a submicron structure using a liquid precursor

Methods for manufacture of a submicron semiconductor structure on a substrate are described. The method may comprise: forming at least one template layer over a support substrate; forming one or more template structures, preferably one or more recesses and/or mesas, in said template layer, said one or more template structures comprising one or...

Single-grain Si thin-film transistors for monolithic 3D-ICs and flexible electronics

We review our recent achievements in monolithic 3D-ICs and flexible electronics based on single-grain Si TFTs that are fabricated inside a single-grain with a low-temperature process. Based on pulsed-laser crystallization and submicron sized cavities made in the substrate, amorphous-Si precursor film was converted into poly-Si having grains that...

Single-grain Si thin-film transistors on flexible polyimide substrate fabricated from doctor-blade coated liquid-Si

Solution process of silicon will provide high-speed transistor fabrication with low-cost by, for example, roll-to-roll process. In this paper, a low-temperature process (350?°C) is reported for fabrication of high-quality Si devices on a polyimide substrate from doctor-blade coated liquid-Si. With this method, different semiconductor devices...

Single-Grain Si TFTs Fabricated by Liquid-Si and Long-Pulse Excimer-Laser

Solution process of silicon using liquid-Si is attractive for fabrication of high-speed flexible electronics. We have fabricated single-grain Si TFTs on location-controlled Si grains with longpulse excimer laser crystallization of spin-coated liquid Si film. The maximum grain diameter is 3.5?m, and the mobilities for electrons and holes are...

Single-grain Si TFTs fabricated by liquid-Si and longpulse excimer-laser (abstract)

Single-Grain Silicon TFTs on a Plastic Substrate by Doctor Blade Coating of Cyclopentasilane

Liquid silicon is found as the material combining both the advantages of high quality silicon devices and the low cost solution processing method. Single-Grain Thin-Film Transistors can be produced by Excimer Laser Annealing of the resulting film and grain location control by the µ-Czochralski process. Other works have used spin-coating and...

The Optimum Driving Method of Super E-paper: The technical research complementing R:eFlex’s businessplan

With the so many available sorts of E-paper, the optimal performing and consumer friendly E-paper needs to be found in order to win the E-paper market. As result of this, researchers from the TU Delft are currently developing a technology that can replace all ordinary papers by one single device, which has outperforming characteristics compared...