Searched for: author:"Verhaar, T.M."
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Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Sarro, P.M. (author)
Lithography as developed for IC device fabrication is a high volume high accuracy patterning technology with strong 2 dimensional (2D) characteristics. This 2D nature makes it a challenge to integrate this technology in a 3 dimensional (3D) manufacturing environment. This article addresses the performance of a waferstepper (ASML PAS5000) in...
journal article 2010
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Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Maury, P. (author), Sarro, P.M. (author)
Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and...
journal article 2010
document
Verhaar, T.M. (author), Wei, J. (author), Sarro, P.M. (author)
In this paper, a process to realize metal lines on the sidewall of high aspect ratio cavities is developed. As an alternative to conventional photoresist, SU8 is used to define patterns on vertical sidewalls of deep cavities while maintaining compatibility with conventional IC processes. When transferring a pattern onto a 3D structure,...
journal article 2009