Searched for: author%3A%22Vollebregt%2C+S.%22
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Bakhshaee Babaroud, N. (author), Rice, S.J. (author), Camarena, M. (author), Serdijn, W.A. (author), Vollebregt, S. (author), Giagka, Vasiliki (author)
In this paper, we present the surface modification of multilayer graphene electrodes with platinum (Pt) nanoparticles (NPs) using spark ablation. This method yields an individually selective local printing of NPs on an electrode surface at room temperature in a dry process. NP printing is performed as a post-process step to enhance the...
journal article 2024
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Zhang, Y. (author), Du, L. (author), Bäcke, Olof (author), Kalbfleisch, Sebastian (author), Zhang, Kouchi (author), Vollebregt, S. (author), Hörnqvist Colliander, Magnus (author)
As the dimensions of interconnects in integrated circuits continue to shrink, an urgent need arises to understand the physical mechanism associated with electromigration. Using x-ray nanodiffraction, we analyzed the stresses in Blech-structured pure Cu lines subjected to different electromigration conditions. The results suggest that the...
journal article 2024
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Pezone, R. (author), Anzinger, Sebastian (author), Baglioni, G. (author), Wasisto, Hutomo Suryo (author), Sarro, Pasqualina M (author), Steeneken, P.G. (author), Vollebregt, S. (author)
Since the performance of micro-electro-mechanical system (MEMS)-based microphones is approaching fundamental physical, design, and material limits, it has become challenging to improve them. Several works have demonstrated graphene’s suitability as a microphone diaphragm. The potential for achieving smaller, more sensitive, and scalable on...
journal article 2024
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Mo, J. (author), Schaffar, Gerald J.K. (author), Du, L. (author), Maier-Kiener, Verena (author), Kiener, Daniel (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Silicon carbide (SiC) coated vertically aligned carbon nanotubes (VACNT) are attractive material for fabricating MEMS devices as an alternative for bulk micromachining of SiC. In order to examine the mechanical properties of SiC-CNT composites at high temperatures, we fabricated VACNT micro-pillars with different amounts of SiC coating and...
conference paper 2024
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Mo, J. (author), Shankar, S. (author), Pezone, R. (author), Zhang, Kouchi (author), Vollebregt, S. (author)
Silicon carbide (SiC) is recognized as an excellent material for microelectromechanical systems (MEMS), especially those operating in challenging environments, such as high temperature, high radiation, and corrosive environments. However, SiC bulk micromachining is still a challenge, which hinders the development of complex SiC MEMS. To...
journal article 2024
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Pezone, R. (author), Baglioni, G. (author), van Ruiten, C. (author), Anzinger, S. (author), Wasisto, H. S. (author), Sarro, Pasqualina M (author), Steeneken, P.G. (author), Vollebregt, S. (author)
As a consequence of their high strength, small thickness, and high flexibility, ultrathin graphene membranes show great potential for pressure and sound sensing applications. This study investigates the performance of multi-layer graphene membranes for microphone applications in the presence of air-loading. Since microphones need a flatband...
journal article 2024
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Mo, J. (author), Niu, Yunfan (author), May, Alexander (author), Rommel, Mathias (author), Rossi, Chiara (author), Romijn, J. (author), Zhang, Kouchi (author), Vollebregt, S. (author)
Integrated circuits based on wide bandgap semiconductors are considered an attractive option for meeting the demand for high-temperature electronics. Here, we report an analog-to-digital converter fabricated in a silicon carbide complementary metal-oxide-semiconductor technology now available through Europractice. The MOSFET component in this...
journal article 2024
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Yue, X. (author), Mo, J. (author), Chen, Zhiyuan (author), Vollebregt, S. (author), Zhang, Kouchi (author), Du, S. (author)
Synchronized rectifiers offer promising solutions for piezoelectric energy harvesting; however, achieving the promised energy extraction performance necessitates using either a bulky inductor or multiple large capacitors, which cannot be on-chip integrated and increase the system form factor. This article introduces a fully integrated...
journal article 2024
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Li, J. (author), Vollebregt, S. (author), Zhang, Y. (author), Shekhar, A. (author), May, Alexander (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study models the trap-induced transient current in silicon carbide metal-oxide...
conference paper 2024
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Mo, J. (author), LI, J. (author), Zhang, Y. (author), Romijn, J. (author), May, Alexander (author), Erlbacher, Tobias (author), Zhang, Kouchi (author), Vollebregt, S. (author)
In this work, a highly linear temperature sensor based on a silicon carbide (SiC) p-n diode is presented. Under a constant current biasing, the diode has an excellent linear response to the temperature (from room temperature to 600°C). The best linearity (coefficient of determination ${R}^{{2}}$ = 99.98%) is achieved when the current density...
journal article 2023
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Baglioni, G. (author), Pezone, R. (author), Vollebregt, S. (author), Cvetanović Zobenica, Katarina (author), Spasenović, Marko (author), Todorović, Dejan (author), Liu, Hanqing (author), Verbiest, G.J. (author), van der Zant, H.S.J. (author), Steeneken, P.G. (author)
Microphones exploit the motion of suspended membranes to detect sound waves. Since the microphone performance can be improved by reducing the thickness and mass of its sensing membrane, graphene-based microphones are expected to outperform state-of-the-art microelectromechanical (MEMS) microphones and allow further miniaturization of the...
journal article 2023
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Shooshtari, M. (author), Vollebregt, S. (author), Vaseghi, Yas (author), Rajati, Mahshid (author), Pahlavan, Saeideh (author)
Detection of hazardous toxic gases for air pollution monitoring and medical diagnosis has attracted the attention of researchers in order to realize sufficiently sensitive gas sensors. In this paper, we fabricated and characterized a Titanium dioxide (TiO2)-based gas sensor enhanced using the gold nanoparticles. Thermal oxidation and sputter...
journal article 2023
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Sattari, R. (author), Hu, D. (author), Liu, X. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal...
journal article 2023
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van Ginkel, H.J. (author), Mitterhuber, Lisa (author), van de Putte, Marijn Willem (author), Huijben, Mark (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Reducing the thermal conductivity of thermoelectric materials has been a field of intense research to improve the efficiency of thermoelectric devices. One approach is to create a nanostructured thermoelectric material that has a low thermal conductivity due to its high number of grain boundaries or voids, which scatter phonons. Here, we present...
journal article 2023
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Zhang, Y. (author), Mo, J. (author), Cui, Z. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When...
conference paper 2023
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Hu, D. (author), Shah, M.B. (author), Fan, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...
journal article 2023
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Peña, Álvaro (author), Matatagui, Daniel (author), Ricciardella, F. (author), Sacco, L.N. (author), Vollebregt, S. (author), Otero, Daniel (author), López-Sánchez, Jesús (author), Marín, Pilar (author), Horrillo, Mari Carmen (author)
Nitrogen dioxide (NO<sub>2</sub>) is a potential hazard to human health at low concentrations, below one part per million (ppm). NO<sub>2</sub> can be monitored using gas sensors based on multi-layered graphene operating at ambient temperature. However, reliable detection of concentrations on the order of parts per million and lower is...
journal article 2023
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Sacco, L.N. (author), Vollebregt, S. (author)
The fabrication and design of carbon-based hierarchical structures with tailored nano-architectures have attracted the enormous attention of the materials science community due to their exceptional chemical and physical properties. The collective control of nano-objects, in terms of their dimensionality, orientation and size, is of paramount...
review 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)
This paper presented integrated electromigration (EM) studies through experiment, theory, and simulation. First, extensive EM tests were performed using Blech and standard wafer-level electromigration acceleration test (SWEAT)-like structures, which were fabricated on four-inch wafers. Second, a molecular dynamics (MD) simulation-based...
journal article 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Y. (author), Vollebregt, S. (author), Fan, J. (author), Zhang, Kouchi (author)
This paper presented a comprehensive experimental and simulation study for thermomigration (TM) accompanying electromigration (EM) at elevated current densities. Both Blech and standard wafer-level electromigration acceleration test (SWEAT)-like test structures, with aluminum (Al) as a carrier, were used for testing and analysis. In Part I of...
journal article 2023
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