Santagata, F. (author), Sun, J. (author), Iervolino, E. (author), Yu, H. (author), Wang, F. (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author), Zhang, Guoyi (author) Purpose: The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper. Design...
journal article 2018
