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Xiao, A. (author)
Due to the fact that microelectronics is made up from various materials with highly dissimilar thermo-mechanical properties, generally the interface between two adjacent materials is the place where delamination related failure most likely would occur. Failure of these interfaces results in decreased reliability and loss of performance of...
doctoral thesis 2012
Xiao, A. (author), Wang, L.G. (author), Van Driel, W.D. (author), Van Der Sluis, O. (author), Yang, D.G. (author), Ernst, L.J. (author), Zhang, G.Q. (author)
conference paper 2007