Searched for: author%3A%22Zhang%2C+Kouchi%22
(1 - 9 of 9)
document
Lu, Zhiwei (author), Li, Xiaoling (author), Wei, Jinxiu (author), Cai, Miao (author), Yang, Daoguo (author), Zhang, Kouchi (author)
UVC-LED is known as a deep ultraviolet LED. The application development and disinfection efficiency of UVC-LED modules are important problems encountered when UVC-LED products are rushed into commercialization. In this article, a specific disinfection experiment with a UVC-LED module was combined to analyze the disinfection efficiency. UVC-LEDs...
conference paper 2022
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Yun, Minghui (author), Cai, Miao (author), Yang, Daoguo (author), Yang, Yiren (author), Xiao, Jing (author), Zhang, Kouchi (author)
Bond wire damage is one of the most common failure modes of metal-oxide semiconductor field-effect transistor (MOSFET) power devices in wire-welded packaging. This paper proposes a novel bond wire damage detection approach based on two-port network measurement by identifying the MOSFET source parasitic inductance (LS). Numerical calculation...
journal article 2022
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Yun, Minghui (author), Yang, Daoguo (author), He, Siliang (author), Cai, Miao (author), Xiao, Jing (author), Zhang, Kailin (author), Zhang, Kouchi (author)
With the emerging wide bandgap (WBG) semiconductor development, the increasing power density and efficiency of power electronic converters may cause more switching oscillation, electromagnetic interference noise, and additional power loss, further increasing the probability of device failure. Therefore, determining and quantifying the failure...
journal article 2022
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Qian, Cheng (author), Gu, Tijian (author), Wang, Ping (author), Cai, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
Sintered nano-silver die-attach materials have been widely used in high-power electronics packaging because of their high thermal and electrical conductivities. In this study, we characterized the tensile properties of sintered nano-silver particles over a range of strain rates and temperatures, and established the constitutive models. First, 50...
journal article 2022
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Cai, Miao (author), Cui, Peng (author), Qin, Yikang (author), Geng, Daoshuang (author), Wei, Qiqin (author), Wang, Xiyou (author), Yang, Daoguo (author), Zhang, Kouchi (author)
Understanding the defect characterization of electronic and mechanical components is a crucial step in diagnosing component lifetime. Technologies for determining reliability, such as thermal modeling, cohesion modeling, statistical distribution, and entropy generation analysis, have been developed widely. Defect analysis based on the...
review 2020
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Cai, Miao (author), Liang, Yonghu (author), Yun, Minghui (author), Chen, Xuan-You (author), Yan, Haidong (author), Yu, Zhaozhe (author), Yang, Daoguo (author), Zhang, Kouchi (author)
A novel silicone rubber elastic key (SREK) is proposed in this paper for surface mounting technology (SMT) applications. Effects of thermal reflowing stress on the mechanical properties of SMT-SREKs are investigated. The manufactured SMT-SREKs, which underwent various reflowing conditions in advance, are subjected to pressing force and...
journal article 2019
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Yang, Ning (author), Yang, Daoguo (author), Zhang, Kouchi (author), Chen, Liangbiao (author), Liu, Dongjing (author), Cai, Miao (author), Fan, Xuejun (author)
The effects of graphene stacking are investigated by comparing the results of methane adsorption energy, electronic performance, and the doping feasibility of five dopants (i.e., B, N, Al, Si, and P) via first-principles theory. Both zigzag and armchair graphenes are considered. It is found that the zigzag graphene with Bernal stacking has...
journal article 2018
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Li, Shengli (author), Liu, Y. (author), Zhang, H. (author), Cai, Hongming (author), Sun, Fenglian (author), Zhang, Kouchi (author)
In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were investigated. The interfacial intermetallic compound (IMC) is Cu<sub>6</sub>Sn<sub>5</sub...
journal article 2018
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Cai, Miao (author), Yang, Daoguo (author), Huang, J. (author), Zhang, Maofen (author), Chen, Xianping (author), Liang, Caihang (author), Koh, S.W. (author), Zhang, Kouchi (author)
The color coordinate shift of light-emitting diode (LED) lamps is investigated by running three stress-loaded testing methods, namely step-up stress accelerated degradation testing, step-down stress accelerated degradation testing, and constant stress accelerated degradation testing. A power model is proposed as the statistical model of the...
journal article 2017
Searched for: author%3A%22Zhang%2C+Kouchi%22
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