Searched for: author%3A%22van+Zeijl%2C+H.W.%22
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Mantri, D. (author), Wymenga, L.F.A. (author), van Turnhout, J. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
Micro-devices that use electric fields to trap, analyze and inactivate micro-organisms vary in concept, design and application. The application of electric fields to manipulate and inactivate bacteria and single-celled organisms has been described extensively in the literature. By contrast, the effect of such fields on viruses is not well...
review 2023
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Sattari, R. (author), Hu, D. (author), Liu, X. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal...
journal article 2023
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Yazdan Mehr, M. (author), Hajipour, Pejman (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Cooremans, Thierry (author), De Buyl, Francois (author), Zhang, Kouchi (author)
Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing...
conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...
conference paper 2023
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Ji, X. (author), van Zeijl, H.W. (author), Jiao, Weiping (author), He, S. (author), Du, L. (author), Zhang, Kouchi (author)
The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...
conference paper 2023
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Ji, X. (author), Du, L. (author), He, S. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...
journal article 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to...
conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
This paper reports the design and fabrication of a 4H-SiC CMOS readout circuit enabling monolithic integration of silicon carbide (SiC) sensors and circuits. Compared to conventional Si electronics, 4H-SiC integrated circuits can sustain operation in harsh conditions such as higher temperatures and radiation levels. The proposed amplifier...
conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
This study presents a novel manufacturing process and design towards an enhanced sensitivity of an in-package relative humidity sensor. The device comprises multi-width interdigital electrodes which make oxide pillars appear during wet chemical etching in the fabrication process. Those oxide pillars appear only in wider areas while completely...
conference paper 2023
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Sun, B. (author), Mo, J. (author), Zhang, Hemin (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The...
conference paper 2023
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Romijn, J. (author), Vollebregt, S. (author), de Bie, Vincent G. (author), Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Leijtens, J.A.P. (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)
The next generation of satellites will need to tackle tomorrow's challenges for communication, navigation and observation. In order to do so, it is expected that the amount of satellites in orbit will keep increasing, form smart constellations and miniaturize individual satellites to make access to space cost effective. To enable this next...
journal article 2023
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Romijn, J. (author), Vollebregt, S. (author), Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)
The wide bandgap of silicon carbide (SiC) has attracted a large interest over the past years in many research fields, such as power electronics, high operation temperature circuits, harsh environmental sensing, and more. To facilitate research on complex integrated SiC circuits, ensure reproducibility, and cut down cost, the availability of a...
journal article 2022
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Yi, H. (author), Öztürk, E. (author), Koelink, Marco (author), Krimmling, Jana (author), Damian, Andrei A. (author), Debski, Wojciech (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)
High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection...
journal article 2022
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Romijn, J. (author), Vollebregt, S. (author), Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Leijtens, Johan (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)
This work demonstrates the first on-chip UV optoelectronic integration in 4H-SiC CMOS, which includes an image sensor with 64 active pixels and a total of 1263 transistors on a 100 mm2 chip. The reported image sensor offers serial digital, analog, and 2-bit ADC outputs and operates at 0.39 Hz with a maximum power consumption of 60 μW, which are...
journal article 2022
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Ji, X. (author), van Zeijl, H.W. (author), Romijn, J. (author), van Ginkel, H.J. (author), Liu, X. (author), Zhang, Kouchi (author)
The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...
conference paper 2022
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Ji, X. (author), van Ginkel, H.J. (author), Hu, D. (author), Schmidt-Ott, A. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to...
conference paper 2022
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Martin, H.A. (author), Sattari, R. (author), Smits, E.C.P. (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...
conference paper 2022
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Romijn, J. (author), Vollebregt, S. (author), May, Alexander (author), Erlbacher, Tobias (author), van Zeijl, H.W. (author), Leijtens, J.A.P. (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)
In this paper, we present a quadrant sun position sensor microsystem device in a silicon carbide technology that operates in a field-of-view of ±33° and reaches a mean error of 1.9° in this range. This will allow, for the first time, an inherently visible blind sun position sensor in a CMOS compatible technology. Opto-electronic integration of...
conference paper 2022
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Martins Da Ponte, R. (author), Gaio, N. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Dijkstra, Paul (author), Dekker, R. (author), Serdijn, W.A. (author), Giagka, Vasiliki (author)
One of the many applications of organ-on-a-chip (OOC) technology is the study of biological processes in human induced pluripotent stem cells (iPSCs) during pharmacological drug screening. It is of paramount importance to construct OOCs equipped with highly compact in situ sensors that can accurately monitor, in real time, the extracellular...
journal article 2021
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Zhang, B. (author), Damian, A.A. (author), Zijl, Jurrian (author), van Zeijl, H.W. (author), Zhang, Y. (author), Fan, J. (author), Zhang, Kouchi (author)
There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for die attach in high-power electronics. The performance of this technology is superior to that of the technology involving the use of lead-free solders. Although Cu NP paste is potentially a low-cost material, it faces the challenge of oxidation...
journal article 2021
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