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- Nanver, L.K. (author), Goudena, E.J.G. (author), van Zeijl, H.W. (author) journal article 1996
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- Kindt, W.J. (author), Van Zeijl, H.W. (author) journal article 1998
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- Nanver, L.K. (author), Nenadovic, N. (author), d'Alessandro, V. (author), Schellevis, H. (author), van Zeijl, H.W. (author), Dekker, R. (author), de Mooij, D.B. (author), Zieren, V. (author), Slotboom, J.W. (author) journal article 2004
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Van Zeijl, H.W. (author), Bijnen, F.G.C. (author), Slabbekoorn, J. (author)To validate the Front- To Backwafer Alignment (FTBA) calibration and to investigate process related overlay errors, electrical overlay test structures are used that requires FTBA [1]. Anisotropic KOH etch through the wafer is applied to transfer the backwafer pattern to the frontwafer. Consequently, the crystal orientation introduces an overlay...conference paper 2004
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Smeets, E.M.J. (author), Bijnen, F.C.G. (author), Slabbekoorn, J. (author), Van Zeijl, H.W. (author)In the MEMS world, increasing attention is being given to 3D devices requiring dual-sided processing. This requires lithography tools that are able to align a wafer to both its back side as front side. Overlay describes how well front and back side layers are positioned with respect to each other. Currently there is no simple and fast method to...conference paper 2004
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- van Zeijl, H.W. (author) doctoral thesis 2005
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- Paalvast, S.L. (author), Van Zeijl, H.W. (author), Su, J. (author), Sarro, P.M. (author), Van Eijk, J. (author) journal article 2007
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- Van Zeijl, H.W. (author), Sarro, P.M. (author) journal article 2010
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Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Maury, P. (author), Sarro, P.M. (author)Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and...journal article 2010
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Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Sarro, P.M. (author)Lithography as developed for IC device fabrication is a high volume high accuracy patterning technology with strong 2 dimensional (2D) characteristics. This 2D nature makes it a challenge to integrate this technology in a 3 dimensional (3D) manufacturing environment. This article addresses the performance of a waferstepper (ASML PAS5000) in...journal article 2010
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- Lafont, U. (author), Van Zeijl, H.W. (author), Van der Zwaag, S. (author) conference paper 2011
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Wei, J. (author), Ye, H. (author), Van Zeijl, H.W. (author), Sarro, P.M. (author), Zhang, G.Q. (author)A micro-electro-mechanical-system (MEMS) based, temperature triggered, switch is developed as a cost-effective solution for smart cooling control of solid-state-lighting systems. The switch (1.0x0.4 mm2) is embedded in a silicon substrate and fabricated with a single-mask 3D micro-machining process. The device switches on at a designed...journal article 2012
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Lafont, U.L. (author), Van Zeijl, H.W. (author), Van der Zwaag, S. (author)While conventional self healing materials focus on the restoration of mechanical properties, newer generations of self healing materials focus on the restoration of other functional (i.e. non-mechanical) properties. Thermal conductivity is an example of an important functional property of a Thermal Interface Material (TIM) for LED’s and...conference paper 2013
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Lafont, U. (author), Van Zeijl, H.W. (author), Van der Zwaag, S. (author)While conventional self healing materials focus on the restoration of mechanical properties, newer generations of self healing materials focus on the restoration of other functional (i.e. non-mechanical) properties. Thermal conductivity is an example of an important functional property of a Thermal Interface Material (TIM) for LEDs and...conference paper 2013
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Poelma, R.H. (author), Morana, B. (author), Vollebregt, S. (author), Schlangen, H.E.J.G. (author), Van Zeijl, H.W. (author), Fan, X. (author), Zhang, G.Q. (author)The porous nature of carbon nanotube (CNT) arrays allows for the unique opportunity to tailor their mechanical response by the infiltration and deposition of nanoscale conformal coatings. Here, we fabricate novel photo-lithographically defined CNT pillars that are conformally coated with amorphous silicon carbide (a-SiC) to strengthen the...journal article 2014
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Cervone, A. (author), Zandbergen, B.T.C. (author), Cordeiro Guerrieri, D. (author), de Athayde Costa e Silva, M. (author), van Zeijl, H.W. (author)The aerospace industry is recently expressing a growing interest in green, safe and non-toxic propellants for the propulsion systems of the new generation of space vehicles, which is especially true in the case of Cubesat micro-propulsion systems. Demanding requirements are associated to the future missions and challenges offered by this class...journal article 2016
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van Wees, T. (author), Hanselaar, C.A.J. (author), Jansen, E (author), Cervone, A. (author), Zandbergen, B.T.C. (author), van Zeijl, H.W. (author)In the last decade, CubeSat development has shown the potential to allow for low-risk, low-cost space missions. To further improve the capabilities of CubeSats in large scale missions, a novel micro-propulsion system is being developed at Delft University of Technology. The system is based on a Vaporizing Liquid Microthruster (VLM), which is...conference paper 2016
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Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author)We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...conference paper 2016
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Koladouz Esfahani, Z. (author), Rostamian, Ali (author), Kolahdouz, Mohammadreza (author), Ma, Teng (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)This study presents a blue light detector for evaluating the output light of phosphor based white LED package. It is composed of a silicon stripe-shaped photodiode designed and implemented in a 2 μm BiCMOS process which can be used for wafer level integration of different passive and active devices all in just 5 lithography steps. The final...journal article 2016
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Vollebregt, S. (author), Alfano, B. (author), Ricciardella, F. (author), Giesbers, A.J.M. (author), Hagendoorn, Y. (author), van Zeijl, H.W. (author), Polichetti, T (author), Sarro, Pasqualina M (author)In this paper we report a novel transfer-free graphene fabrication process, which does not damage the graphene layer. Uniform graphene layers on 4" silicon wafers were deposited by chemical vapor deposition using the CMOS compatible Mo catalyst. Removal of the Mo layer after graphene deposition results in a transfer-free and controlled placement...conference paper 2016