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Herrmann, A. (author), van Soestbergen, M. (author), Erich, S. J.F. (author), van der Ven, L. G.J. (author), Huinink, H. P. (author), van Driel, W.D. (author), Mavinkurve, A. (author), De Buyl, F. (author), Adan, O. C.G. (author)
The risk of corrosion poses a challenge to meet the stringent reliability requirements of microelectronic devices that are used in harsh environments. Microelectronic devices are often encapsulated in polymer packaging materials, which protect them from corrosion. These polymers are, however, not completely hermetic and thus allow small...
journal article 2022
document
Herrmann, A. (author), Erich, S. J.F. (author), van der Ven, L. G.J. (author), Huinink, H. P. (author), van Driel, W.D. (author), van Soestbergen, M. (author), Mavinkurve, A. (author), De Buyl, F. (author), Fischer, H. R. (author), Mol, J.M.C. (author), Adan, O. C.G. (author)
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influences, with one of these influences being moisture ingress, causing corrosion. To obtain the needed thermal and mechanical properties EMCs require a high loading of (silica) fillers, introducing a large amount of interface. While silane coupling...
journal article 2022