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Chen, Yuanyuan (author), Dai, Hanqing (author), Hu, Zhe (author), Wei, Jinxin (author), Zhou, Wenjie (author), Duan, Zhongtao (author), Cui, Zhongjie (author), Wei, Wei (author), Zhang, Kouchi (author)Hydrogel materials have biocompatibility, flexibility, transparency, self-healing ability, adhesion with various substrates, anti-freeze ability, and high-temperature resistance. However, the existing hydrogel devices cannot continue to operate in the case of damage, and they cannot work during the repair period, which brings great challenges...journal article 2023
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Chen, Wei (author), Chen, Ye (author), Cao, Yixing (author), Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical...journal article 2022
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Li, Huanhuan (author), Younes, S.H.H. (author), Chen, Shaohang (author), Duan, Peigao (author), Cui, Chengsen (author), Wever, Ron (author), Zhang, Wuyuan (author), Hollmann, F. (author)In this contribution, we report chemoenzymatic bromodecarboxylation (Hunsdiecker-type) of α,ß-unsaturated carboxylic acids. The extraordinarily robust chloroperoxidase from Curvularia inaequalis (CiVCPO) generated hypobromite from H2O2 and bromide, which then spontaneously reacted with a broad range of unsaturated carboxylic acids and yielded...journal article 2022
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Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, Kouchi (author)Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...conference paper 2018
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Cui, Z. (author), Zhang, Yingying (author), Yang, Qun (author), Zhang, Kouchi (author), Chen, Xianping (author)Interfacial properties of Cu/SiO<sub>2</sub> in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO<sub>2</sub>. The...conference paper 2018