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document
Ishihara, R. (author), Trifunovic, M. (author), Van der Zwan, M. (author)
A method for low-temperature formation of a silicon/silicon-oxide structure on a substrate is described wherein the method comprises: forming a first (poly)silane layer over at least part of a substrate; transforming said first (poly)silane layer directly into a (crystalline) silicon layer by exposing said first (poly)silane layer to UV...
patent 2016
document
Ishihara, R. (author), Trifunovic, M. (author), Van der Zwan, M. (author)
A method for forming a silicon layer using a liquid silane compound is described wherein said method comprises the steps of forming a first layer on a substrate, preferably a flexible substrate, said first layer comprising a (poly)silane; and, irradiating said first light ight comprising one or more wavelength within the range between 200 and...
patent 2014
document
Ishihara, R. (author), Van de Zwan, M. (author), Trifunovic, M. (author)
Methods for manufacture of a submicron semiconductor structure on a substrate are described. The method may comprise: forming at least one template layer over a support substrate; forming one or more template structures, preferably one or more recesses and/or mesas, in said template layer, said one or more template structures comprising one or...
patent 2014
document
Ishihara, R. (author), Van der Zwan, M. (author)
A method for the manufacture of at least part of a thin-film device is described wherein, said method comprise: forming one or more indentations in a substrate, preferably a plastic substrate, an indentation comprising sidewalls and a base; filling at least one of said one or more indentations with a first ink, said first ink comprising a first...
patent 2013
document
Ishihara, R. (author), Baiano, A. (author)
The invention relates to a method for manufacturing a semiconductor device on a substrate provided with a silicon-oxide layer, by forming at least one hole in said silicon-oxide layer and depositing on said silicon-oxide layer an amorphous silicon-film which fills said at least one hole and covers a surrounding area of said hole, wherein said...
patent 2009
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