Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications

The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging cost low. In this trend, unconventional devices ...

Device Realization, Characterization and Modeling for Linear RF Applications

This thesis work addresses semiconductor device technology, characterization and modeling solutions that support the development of future generations of mobile phones, which are able to handle various wireless services in flexible manner. Today’s plurality of high data-rate communication signals requires high linearity and efficiency of the...

High-Aspect-Ratio CMOS add-on modules for RF passive components

Commercial wireless communication technologies stemmed mostly from the research done through and after the Second World War as outlined in Chapter 1. Earlier systems were intended for military applications, hence had very high performance and were very expensive and bulky. Later, with the dawn of commercial microwave applications, the systems...

Substrate Crosstalk Suppression Using Wafer-Level Packaging: Metalized Through-Substrate Trench Approach

The demand for miniaturization technology has been increasing over the last decades. Consumer electronics end-users often, if not always, go for more functionality and practicality. This is translated into systems that are more complex and yet smaller in size such as smart cellular phones and portable audio/video systems. System on Chip (SoC) is...

Highly Efficient and Highly Linear RF Power Amplifiers

Vanwege vertrouwelijke informatie is een deel van de publicatie niet opgenomen in de repository. Due to confidential information a part of the publication is not presented in the repository.

Ultra Linear Low-loss Varactors & Circuits for Adaptive RF Systems

With the evolution of wireless communication, varactors can play an important role in enabling adaptive transceivers as well as phase-diversity systems. This thesis presents various varactor diode-based circuit topologies that facilitate RF adaptivity. The proposed varactor configurations can act as variable capacitors with high tuning range,...

Electronics on Flexible and Stretchable Silicon Arrays

Magnetic materials and devices for integrated radio-frequency electronics

A Scalable Mextram Model for Advanced Bipolar Circuit Design

In this thesis, a referenced based scaling approach and its parameter extraction for the bipolar transistor model Mextram is proposed. It is mainly based on the physical properties of the Mextram parameters, which scale with the junction temperature and geometry of the bipolar transistor. The scalable electrical parameter in the scaling rules is...

Wafer-level packaging technology for RF applications based on a rigid low-loss spacer substrate

As mobile portable devices such as cellular system/phones, smart handheld devices and laptop computers acquire wireless connectivity there is a growing demand for greater levels of RF integration. The holy grail of integration is to have a whole set of different components integrated into one chip. However, for RF front-end the problem is the...

Smoothie: A model for linearity optimization of FET devices in RF applications

Enhanced Techniques for the Design and Characterization of RF Power Amplifiers

RF Amplifier Design Techniques for Linearity and Dynamic Range

This thesis presents circuit- and device-level linearization techniques to reduce the intermodulation distortion as well as the DC power consumption in RF amplifier circuits. As a key method to accomplish the research goals presented in Chapter 1, a so-called orthogonal design approach is introduced that allows for an uncompromised optimization...

Silicon Micromachining for RF Technology