Substrate Crosstalk Suppression Using Wafer-Level Packaging: Metalized Through-Substrate Trench Approach

The demand for miniaturization technology has been increasing over the last decades. Consumer electronics end-users often, if not always, go for more functionality and practicality. This is translated into systems that are more complex and yet smaller in size such as smart cellular phones and portable audio/video systems. System on Chip (SoC) is...