Searched for: contributor:"Burghartz, J.N. (promotor)"
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Tian, J. (author)
The current trend in electronic packaging research is to integrate more functions into one package, reduce electrical path parasitic, and increase the heat conduction in order to make the final packaged system smaller, more reliable, more functional and more complete, while keeping the packaging cost low. In this trend, unconventional devices ...
doctoral thesis 2013