Superconducting Funnelled Through-Silicon Vias for Quantum Applications

System downscaling, 3D integration, and increasing functionalities are the main challenges that integrated circuits and MEMS technology have dealt with in the past decade. Advanced packaging schemes and interconnect technologies are some of the successful approaches to tackle the challenges. These issues also extend to modern designs such as...

On-chip integration of Si/SiGe-based quantum dots and electronic circuits for scaling

With continuous breakthroughs in quantum science and technology in recent years, the development of quantum computers is moving from pure scientific research to engineering realization. Meanwhile, the underlying physical structures also develop from the initial single qubit to multiple qubits or medium-scale qubit registers. Since qubits are...

Liquid Silicon for Printed Polycrystalline Silicon Thin-Film Transistors on Paper