Searched for: contributor%3A%22Jansen%2C+K.M.B.+%28promotor%29%22
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Li, X. (author)
This thesis is motivated by the vision of designing smart wearables as partners for veterans with chronic posttraumatic stress disorder (PTSD). Everyday objects are becoming ‘smarter’ with the integration of computational and electronic technologies. It is now possible to start thinking of these objects as ‘intelligent agents’ that can form...
doctoral thesis 2022
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Rezaie Adli, A.R. (author)
This thesis comprises a thorough study of the microelectronics packaging process by means of various experimental and numerical methods to estimate the process induced residual stresses. The main objective of the packaging is to encapsulate the die, interconnections and the other exposed internal components by providing mechanical protection,...
doctoral thesis 2017
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Shi, L. (author)
Nowadays more and more large composites are used to replace the traditional metallic structural materials in the industries. However, for manufacturing the thick thermoset composites, the size not only influences the mechanical properties in the completed products, but also the core temperature overshoot generated during the curing reaction....
doctoral thesis 2016
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Öztürk, B. (author)
Adhesives based on thermoset polymers are used as thermal and electrical interfaces. These adhesives are filled with different particles in order to meet the requirements of heat transfer and electrical properties. Due to the reliability requirements of automotive applications, they are required to have excellent bulk and interface properties....
doctoral thesis 2015
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Ma, X. (author)
This research aims at developing a knowledge based fast qualification method for moisture or thermally induced failure in microelectronic packages. Driven by the market competition and the need for shorter time to market, fast qualification tests are becoming more and more important for the industry. Qualifications are tests which are used in...
doctoral thesis 2011
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De Vreugd, J. (author)
doctoral thesis 2011
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Wang, L. (author)
Conventional IC packages form a rigid shell around silicon IC dies. Their purpose is to provide environmental protection, electrical interconnect and heat dissipation. Despite the fact that majority of current silicon IC?s are realized in a very thin top layer of the silicon substrate (<10µm), the typical thickness of packaged IC dies generally...
doctoral thesis 2010
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