Design of moisture vapor pressure sensor for popcorn failure analysis in molding compound

Moisture absorbed by the hygroscopic polymers like molding compound and die-attach vaporizes during reflow lead to a high vapor pressure inside the electrical components lead to failure in the electrical device, named as popcorn failure. Popcorn failure in plastic encapsulated microcircuits has been a critical issue for electronic device...

High aspect ratio surface micro-machining using carbon nanotubes

Silicon-based MEMS technology has been the standard for developing 2D and 3D<br/>micro-structures for many years. There are 2 main classifications of MEMS manufacturing technologies, viz. bulk micro-machining, and surface micro-machining.<br/>These techniques have its own set of drawbacks. Bulk micro-machining affects the structural integrity of...