Searched for: contributor%3A%22Taouil%2C+M.+%28mentor%29%22
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van Wijk, Rijk (author)
Forensics is the art of gathering evidence, which for electronics amounts to accurately recovering data. Often, this can only be archived with state-of-the-art hacking techniques.<br/>However, replicating state-of-the-art research in hardware security can be difficult, due to the large number of components and connections. To counter this, a...
master thesis 2023
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ZHANG, ZIWEI (author)
Spin-transfer-torque magnetic random access memory (STT-MRAM) is regarded as one of the most promising non-volatile memory (NVM) technologies, which has the potential to replace the traditional memories in the modern memory hierarchy. Due to some advantages such as non-volatility, fast access speed, low leakage power and high density, more and...
master thesis 2022
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Granneman, Erik (author)
The increasing advancements in quantum computing have led to an increasing danger for the cyberspace. The current cryptographic algorithms that are used to enable secure communication across insecure channels have the potential to be brute-forced by sufficiently powerful quantum computers, endangering the security of many electronic devices and...
master thesis 2022
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Belloli, Davide (author)
The issue of securing microchip designs against hardware attacks has grown in magnitude as more and more embedded systems are deployed in hostile environments, where security measures have to be taken to prevent attackers from accessing unwanted information.<br/>The first step in solving this problem is gaining awareness of the security...
master thesis 2021
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van Leenen, Ryan (author)
Some server hosters facilitate cyber crime either intentionally (so called “bulletproof hosters”) or unintentionally (“bad hosters”). When dealing with uncooperative hosters during forensic investigations, it may sometimes be necessary to collect data or information on the servers without help from the owner of the server....
master thesis 2021
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Saxena, Mudit (author)
As of 2021, the world economic forum deems cyber-security failures as one of the most potent threats to the world. According to a McAfee report, the cost of cybercrimes in 2020 reached nearly 1 trillion US dollars, which was around 50 percent more than what it was in 2018. Exacerbating the already mammoth financial implication of such a failure...
master thesis 2021
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Okkerman, Hans (author)
The Internet of Things (IoT) has grown dramatically over the past years. Largely autonomous, lightweight devices with an internet connection have been integrated into many aspects of daily life; from consumer products to industrial processes and from medical applications to critical infrastructures. Cisco predicts that by 2023, more than half of...
master thesis 2020
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Zwalua, Marc (author)
Within a world that increasingly relies on connected devices, security and reliability have become more important then ever. Whereas failures in digital components used to have a limited effect, nowadays an attack on a critical digital infrastructure impacts our daily lives on a huge scale. Due to these impacts it is estimated that the financial...
master thesis 2020
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Talluri, Pavan (author)
The adoption of Microprocessors is increasingly diversifying to several embedded and mo- bile devices. Growingly they can also be found in Smart Cards, RFID tags, SIM cards, Pay TVs, identity cards and passports. These devices store, processes and transact sensitive information like social security numbers and credit card numbers. Ensuring...
master thesis 2020
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van Beusekom, Mark (author)
Forensic science is the cornerstone of the modern justice system, as it allows us to analyze evidence in order to discover the truth behind a crime scene. As mobile phones became more important to our daily lives they've taken up a bigger part in forensic research as well. These devices contain digital traces telling us the story of our lives....
master thesis 2019
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Masadeh, M. (author)
Three-dimensional stacked ICs (3D-SICs) technology based on Through-Silicon Vias (TSVs) provides numerous advantages as com- pared to traditional 2D-ICs. TSVs are holes going vertically through the chip silicon substrate filled with a conducting material. A potential application is a 3D-SIC where one or more memory dies are stacked on a logic...
master thesis 2013
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