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González-Andrade, D. (author), de Cabo, R. Fernández (author), Vilas, J. (author), Dinh, T. T.D. (author), Luque-González, J. M. (author), Oser, D.J.H. (author), Aubin, G. (author), Amar, F. (author), Dias, A. (author)
Integration of photonic circuits on silicon offers a unique opportunity to address the scaling of inter- and intra-chip communications in an energy-efficient and cost-effective manner. Mode-division multiplexing (MDM) is deemed as one of the most promising technologies to increase aggregated data bandwidth and avoid a communication capacity...
conference paper 2023
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Wörhoff, Kerstin (author), Prak, Albert (author), Postma, F. (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...
conference paper 2016
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Peters, T.J. (author), Tichem, M. (author)
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for sub-micrometer precision in the alignment of the waveguides of two photonic integrated circuits (PICs). The concept consists of two steps: chip-to-chip positioning and chip bonding provide a coarse alignment after which waveguide-to-waveguide...
conference paper 2016