Searched for: contributor:"Zeijl, H.W. (mentor)"
(1 - 4 of 4)
document
Li, J. (author)
System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...
master thesis 2015
document
Yi, H. (author)
On chip grown CNT nanofoam has a large surface to volume ratio and excellent thermal electrical properties, which is suitable to be used as a thermoacoustic heater. The highly porous foam exchanges heat with surrounding air efficiently. Every processing step is specifically designed to be CMOS compatible using cleanroom microfabrication. This...
master thesis 2015
document
Arutchelvan, G. (author)
CMOS scaling over the years has brought great improvements in the computational speed, density and cost of microprocessors. However, scaling is approaching its limits owing to the difficulty in reducing the supply voltage with conventional MOSFETs having at best a subthreshold swing of 60mv/decade. A possible alternative is Tunnel FETs (TFETs)...
master thesis 2014
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Damian, A. (author)
The current thesis is organized into 7 chapters. Chapter 1 offers a brief overview of the current research work and presents the project objectives, report structure and the relevant 3D integration challenges . The introductory section 1.1 provides the motivation for the current work by matching the current requirements in 3D integration with...
master thesis 2013
Searched for: contributor:"Zeijl, H.W. (mentor)"
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