Experimental Study on Electromigration by Using Blech Structure

In the advanced semiconductor industry, modern electronic devices are expected to realize complex functions with minimized size, which requires an increase in the density of on-chip interconnects. To meet this demand, the dimension of interconnects is reduced and it requires the narrowing of metal interconnects to carry the increasing current...

MEMS Switches by Carbon Nanotubes with Silicon Carbide Coating

The research of advanced material such as Carbon Nanotubes (CNT) has attracted considerable attention in achieving high efficiency and good performance in the electrical and electronic system during the last few decades. In this research project, the designs and fabrication process for microswitches which are made by carbon nanotubes have been...

Fabrication and characterisation of high aspect ratio MEMS electrochemical sensor

A high aspect ratio and large current 3D electrochemical sensor was de- signed. This miniaturized sensor was built by using silicon microfabrication technologies in comparison to screen printed electrode. New tilting tool for CHA solution platinum evaporator is designed and realized. The analysis of tilt angles and rotation for evaporation of...

A Miniaturized Temperature Controlled Capacitive MEMS Transducer for MOF based Gas Sensing Applications

Sensors have been used in different forms and fields, where the sensors play important roles in identifying and quantifying different environmental conditions for various purposes used in mobile applications. Among these are the MOX and polymer based sensors. However, the MOX sensors have larger power consumption and poor selectivity. The main...

Thermally Driven Sound Source: Application of CNT nanofoams

On chip grown CNT nanofoam has a large surface to volume ratio and excellent thermal electrical properties, which is suitable to be used as a thermoacoustic heater. The highly porous foam exchanges heat with surrounding air efficiently. Every processing step is specifically designed to be CMOS compatible using cleanroom microfabrication. This...

T12 Electromagnetic Ballast Modeling And Retrofit LED Tube Driver Design

LED lamps have become increasingly popular in the market thanks to high energy efficiency. Tubular LED lamps are widely adopted to replace conventional linear fluorescent lamps, like T8 and T12. Compared with rewiring of fixtures (remove or bypass the ballast) retrofit LED Tubes (TLED), which can be directly powered by the existing ballast, are...

Low temperature fine pitch vertical wafer level interconnection using copper nanoparticles

Nowadays, the demand for enhanced performance and reliability in micro and nano systems is growing, especially for fine pitch wafer level integration. Due to reliability and processing issues, lead containing solders are still allowed and being used in high demanding microelectronics bonding application. Potential for reliable environmental...

Monolithic integration of light sensor readout system for multi-functional LED wafer-level packaging based on BICMOS process

LED-based lighting is becoming increasingly popular in recent year, but LED development especially for lighting application now seems unavoidable. The various benefits of LEDs and the continuous increase in their performance allied to the decrease of the manufacturing costs makes it quite attractive. It is widely believed that LEDs would be a...

Monolithic Integration of Rectifiers and Drivers for low power SSL applications on a Rigid to Flex Substrate

Solid State Lighting (SSL) is one of the prominent light sources for future lighting applications with benefits such as high energy savings, long lifetimes and high efficiency. The main drawback in solid state lighting system is that the total initial cost of the system is high for large scale production. Packaging and electronics components in...

Wireless control of LED display lighting system using Bluetooth and Android

This thesis will describe our research and process during the Bachelor project "Wireless control of LED lighting system using Bluetooth and Android". Our team was a 4 man team, where we, the authors, worked on the Android app development, the PCB design and the Power Supply. For work done on an FPGA and the flexible LEDs, see thesis written by P...

Foldable 3D Wafer Level SSL Package Using Flexible Interconnect

Solid State Lighting (SSL) is on track to replace conventional incandescent and fluorescent sources for general lighting. Even though it offers many benefits, the high initial device costs are still a major hindrance for many consumers. Packaging can account for up to half of the total device price, offering high potential for cost reduction. In...

Low Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D Interconnect Fabrication

The current thesis is organized into 7 chapters. Chapter 1 offers a brief overview of the current research work and presents the project objectives, report structure and the relevant 3D integration challenges . The introductory section 1.1 provides the motivation for the current work by matching the current requirements in 3D integration with...