HV power MOSFET embedding

Power electronics are an important technology used to convert electricity from a source like a battery or high voltage DC bus to more usable forms of electricity. This has to be done efficiently, reliably and without failures which is critical in applications like electric cars or datacenters. Power MOSFETs with upcoming SiC and GaN devices are...

Thermal Analysis of Cu Pillars

THERMAL management is a very crucial step to ensure the reliability of Integrated Circuits (IC)s. The increase in power density has resulted in the formation of multiple, high-intensity, and non-uniform hotspots. This has not only affected the lifetime but also the performance of several devices. Optimization of the package design and layout are...

Smart Personal Protective Equipment: On-Board Power Management

The COVID-19 pandemic caused a shortage of Personal Protective Equipment for Healthcare personnel. This project aims to aid in this shortage by extending the lifetime of the filter material used in a mask. This is done in the form of an SPPE, a Smart Personal Protective Equipment. This face mask has two smart filter heads that are modular and...

Smart Personal Protective Equipment: UVGI

The Smart Personal Protective Equipment (SPPE) is proposed as a result of the COVID-19 pandemic, which has led to shortages of standard face masks. This thesis describes one of the three subsystems of the SPPE, namely the Ultraviolet Germicidal Irradiation (UVGI). The UVGI subsystem provides the SPPE with an in situ disinfection system, in order...

Smart Personal Protective Equipment: Sensing and Control: The future of face masks

The current COVID-19 pandemic shows the necessity of personal protective equipment and face masks. In the project, a filter module with an in-situ ultraviolet-sterilization technique is designed that can serve as a new kind of smart personal protective equipment (SPPE). This technique is not used in wearable devices as of yet. The project thus...

Wafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration

System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...

Thermally Driven Sound Source: Application of CNT nanofoams

On chip grown CNT nanofoam has a large surface to volume ratio and excellent thermal electrical properties, which is suitable to be used as a thermoacoustic heater. The highly porous foam exchanges heat with surrounding air efficiently. Every processing step is specifically designed to be CMOS compatible using cleanroom microfabrication. This...

Process Integration for Graphene Tunnel Field Effect Transistors

CMOS scaling over the years has brought great improvements in the computational speed, density and cost of microprocessors. However, scaling is approaching its limits owing to the difficulty in reducing the supply voltage with conventional MOSFETs having at best a subthreshold swing of 60mv/decade. A possible alternative is Tunnel FETs (TFETs)...