HV power MOSFET embedding

Power electronics are an important technology used to convert electricity from a source like a battery or high voltage DC bus to more usable forms of electricity. This has to be done efficiently, reliably and without failures which is critical in applications like electric cars or datacenters. Power MOSFETs with upcoming SiC and GaN devices are...

Thermal Analysis of Cu Pillars

THERMAL management is a very crucial step to ensure the reliability of Integrated Circuits (IC)s. The increase in power density has resulted in the formation of multiple, high-intensity, and non-uniform hotspots. This has not only affected the lifetime but also the performance of several devices. Optimization of the package design and layout are...

Wafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration

System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...

Thermally Driven Sound Source: Application of CNT nanofoams

On chip grown CNT nanofoam has a large surface to volume ratio and excellent thermal electrical properties, which is suitable to be used as a thermoacoustic heater. The highly porous foam exchanges heat with surrounding air efficiently. Every processing step is specifically designed to be CMOS compatible using cleanroom microfabrication. This...

Process Integration for Graphene Tunnel Field Effect Transistors

CMOS scaling over the years has brought great improvements in the computational speed, density and cost of microprocessors. However, scaling is approaching its limits owing to the difficulty in reducing the supply voltage with conventional MOSFETs having at best a subthreshold swing of 60mv/decade. A possible alternative is Tunnel FETs (TFETs)...