Optimising topographical pillar placement for thermal heat distribution with Artificial Intelligence

The increased heat on an integrated circuit is a limiting factor for the performance and lifetime of a chip. The increased power density on chips resulted in increased heat and the formation of non-uniform hotspots. Earlier research has shown that the package design and layout of package components in flip-chip design can influence the thermal...

Thermal Analysis of Cu Pillars

THERMAL management is a very crucial step to ensure the reliability of Integrated Circuits (IC)s. The increase in power density has resulted in the formation of multiple, high-intensity, and non-uniform hotspots. This has not only affected the lifetime but also the performance of several devices. Optimization of the package design and layout are...