Electronic tuning of integrated blue-violet GaN tunable coupled-cavity laser

We demonstrate an integrated tunable coupled-cavity InGaN/GaN laser with the emission wavelength centered on 409 nm. The electronic tuning range was 1.6 nm and threshold currents were 650 mA per cavity for 8.7-?m-wide laser ridges. Multimode laser emission with an average full width at half maximum of 0.3 nm was observed. We estimate the...

Nanopillar growth by focused helium ion-beam-induced deposition

A 25 keV focused helium ion beam has been used to grow PtC nanopillars on a silicon substrate by beam-induced decomposition of a (CH3)3Pt(CPCH3) precursor gas. The ion beam diameter was about 1 nm. The observed relatively high growth rates suggest that electronic excitation is the dominant mechanism in helium ion-beam-induced deposition. Pillars...

Nanofabrication with a High Resolution Helium Ion Beam

Compact Mach-Zehnder interferometer based on self-collimation of light in a silicon photonic crystal

We demonstrate a compact silicon photonic crystal Mach-Zehnder interferometer operating in the self-collimation regime. By tailoring the photonic band structure such as to produce self-collimated beams, it is possible to design beam splitters and mirrors and combine these to a 20 × 20 ?m2 format. With transmission spectroscopy we find a...

Roles of secondary electrons and sputtered atoms in ion-beam-induced deposition

The authors report the results of investigating two models for ion-beam-induced deposition (IBID). These models describe IBID in terms of the impact of secondary electrons and of sputtered atoms, respectively. The yields of deposition, sputtering, and secondary electron emission, as well as the energy spectra of the secondary electrons were...

Method for improving the aspect ratio of ultrahigh-resolution structures in negative electron-beam resist

A method for improving the aspect ratio of ultrahigh-resolution structures in negative electron-beam resist is provided for enhanced pattern-transfer capabilities. The essence of the proposed method is to form a protective “cap” on top of the resist structure by means of electron-beam-induced deposition (EBID) in a self-aligned approach. This is...

Sub-10-nm nanolithography with a scanning helium beam

Scanning helium ion beam lithography is presented as a promising pattern definition technique for dense sub-10-nm structures. The powerful performance in terms of high resolution, high sensitivity, and a low proximity effect is demonstrated in a hydrogen silsesquioxane resist.

Wavelength-sized, tunable nanocavity in deeply etched InP/InGaAsP/InP photonic crystals

Wavelength-sized point defect cavities coupled to access waveguides are reported for deeply etched InP/InGaAsP/InP two-dimensional photonic crystals. The observed quality factor of 60 is comparable to those found for one-row defect Fabry–Perot cavities and for simple point defect cavities in membranes. The quality factor was changed by varying...

Proximity effect in ion-beam-induced deposition of nanopillars

Ion-beam-induced deposition (IBID) is a powerful technique for prototyping three-dimensional nanostructures. To study its capability for this purpose, the authors investigate the proximity effect in IBID of nanopillars. In particular, the changes in shape and dimension of pillars are studied when a second pillar is grown near an existing pillar....

Influence of hydrogen silsesquioxane resist exposure temperature on ultrahigh resolution electron beam lithography

Performance of hydrogen silsesquioxane (HSQ) resist material with respect to the temperature during electron beam exposure was investigated. Electron beam exposure at elevated temperatures up to 90?°C shows sensitivity rise and slight contrast (?) degradation compared to lower temperature cases. Ultrahigh resolution structures formed at elevated...

Comparative study of Cl2, Cl2/O2, and Cl2/N2 inductively coupled plasma processes for etching of high-aspect-ratio photonic-crystal holes in InP

An extensive investigation has been performed on inductively coupled plasma etching of InP. An important motivation for this work is the fabrication of high-aspect-ratio holes for photonic crystals. The essential chemistry is based on Cl2 with the addition of N2 or O2 for sidewall passivation. The influence of different process parameters such...