Addressing large-scale qubit arrays for quantum computer

The recent implementation of single electron quantum dots (QDs) in semiconductor hetero-structures as quantum bits (Qbits) [1] disclosed a promising route for the forthcoming creation of the first quantum computers based on a large set of Qbits. The scaling up of Qbits would indeed exhibit the full potential of quantum computation. Confinement...

An Evaluation of Silicon Carbide Based Bimorph Actuators for Optical Coherence Tomography Applications

Optical coherence tomography (OCT) probes rely on MEMS micro-scanners to provide fast and reproducible scans covering as much area as possible. A popular choice of actuators employed in this role are electrothermal bimorph actuators. They comprise of two layers of different materials which are rigidly joined together. Differential expansion...

Wafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration

System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...

Super-growth of CNTs based on ZrN for TSV application

This thesis has explored the possibility of using carbon nanotubes (CNT) as a novel material for through-silicon vias (TSV) in 3D-integrated circuits. With the steady downscaling trend of the semiconductor industry, a major limiting factor to the overall performance of the device is the delay from interconnects; a trend that is worsening over...

Electrical characterization of PureB layers in contacts, diodes and transistors