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Mo, J. (author), Schaffar, Gerald J.K. (author), Du, L. (author), Maier-Kiener, Verena (author), Kiener, Daniel (author), Vollebregt, S. (author), Zhang, Kouchi (author)Silicon carbide (SiC) coated vertically aligned carbon nanotubes (VACNT) are attractive material for fabricating MEMS devices as an alternative for bulk micromachining of SiC. In order to examine the mechanical properties of SiC-CNT composites at high temperatures, we fabricated VACNT micro-pillars with different amounts of SiC coating and...conference paper 2024
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Poola, Lakshmi (author), John, Luis Henrik (author), Godkhindi, Shrutkirthi S. (author), Reddy, Preetham (author), Rao, Deeksha P. (author), Prabhakar, T. V. (author), Venkatesha Prasad, Ranga Rao (author)The recent spate of natural disasters such as earthquakes and floods destroyed buildings and caused loss of lives. Many times, the loss of life is attributed to slow response and not being able to reach the survivors. In such scenarios, the staggering number of deaths in the aftermath of a disaster can be reduced if information about survivors...conference paper 2024
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Ruggeri, J. (author), Strube, J. (author), Dowling, K.M. (author)This paper reports on the creation of a novel 3D Hall-effect sensor based on an anisotropically etched, inverted pyramid structure. Specific biasing and sensing contact configurations are employed to extract the in-plane or out-of-plane components of the magnetic field, eliminating cross-sensitivity by symmetry. Simulations were performed to...conference paper 2024
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Bakker, S. (author), Knödler, L. (author), Spahn, M. (author), Böhmer, J.W. (author), Alonso-Mora, J. (author)In this paper, we address the problem of real-time motion planning for multiple robotic manipulators that operate in close proximity. We build upon the concept of dynamic fabrics and extend them to multi-robot systems, referred to as Multi-Robot Dynamic Fabrics (MRDF). This geometric method enables a very high planning frequency for high...conference paper 2024
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Wang, S. (author), Zong, Qihang (author), Yang, Huiru (author), Huang, Qianming (author), Ye, Huaiyu (author), French, P.J. (author)In recent years, flexible strain sensors based on metal cracks have garnered significant interest for their exceptional sensitivity. However, striking a balance between sensitivity and detection range remains a significant challenge, which often limits its wider application. Herein, we introduce an innovative laser transmission pyrolysis...conference paper 2024
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Ross, Martin K. (author), Broz, F. (author), Baillie, Lynne (author)Repetitive, individual exercises can improve the functional ability of stroke survivors over the long term. With the aim of providing extra motivation to adhere to repetitive, individual rehabilitation, this paper presents a robotic coach for stroke rehabilitation. Our system uses the Pepper robot and performs one of twelve data-driven...conference paper 2024
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Zaga, Cristina (author), Lupetti, M.L. (author), Forster, D. (author), Murray-Rust, D.S. (author), Prendergast, J.M. (author), Abbink, D.A. (author)In Industry 5.0, cognitive robots and workers will engage in evolving and reciprocal relations, which we call worker-robot relationships (WRRs). To enable evidence-based work futures with workers, we must co-develop WRRs and understand their impact on work, workers, management, and society. To this end, we posit that the HRI field should work...conference paper 2024
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Allen, Katherine H. (author), Aronson, Reuben M. (author), Bhattacharjee, Tapomayukh (author), Broz, F. (author), Chang, Mai Lee (author), Collier, Maggie (author), Faulkner, Taylor Kessler (author), Lee, Hee Rin (author), Neto, Isabel (author)This full-day workshop addresses the problems of accessibility in HRI and the interplay of ethical considerations for disability-centered design and research, accessibility concerns for disabled researchers, and the design of assistive HRI technologies. We invite authors to submit extended abstracts (up to 2 pages, excluding references) and...conference paper 2024
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Murray-Rust, D.S. (author), Gorbet, Matt (author), Filthaut, L. (author), Lupetti, M.L. (author), van der Helm, A.J.C. (author), Chiu, Adrian (author), Ianniello, A. (author), Beesley, Philip (author)This work illustrates how artistic robotic systems can provide a reservoir of unfamiliarity and a basis for speculation, to open the field toward new ways of thinking about HRI. We reflect on a collaborative project between design students, a media art studio, and design researchers working with the baggage handling department of the Schiphol...conference paper 2024
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Cila, N. (author), Gonzalez Gonzalez, I. (author), Jacobs, Jan (author), Rozendaal, M.C. (author)Using HRI theory to inform robot development is an important, but difficult, endeavor. This paper explores the relationship between HRI theory and HRI practice through a design project on the development of design guidelines for human-robot communication together with a dairy farming robot manufacturer. The design guidelines, a type of...conference paper 2024
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Hu, D. (author), Wang, Chieh (author), Li, Z. (author), Gupta, N. (author), Poelma, René H. (author), Shi, Ziliang (author), Fan, J. (author), Zhang, Kouchi (author)Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...conference paper 2024
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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...conference paper 2024
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Li, Wenyu (author), Chen, Wei (author), Jiang, Jing (author), Wang, Wenbo (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...conference paper 2024
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Hu, X. (author), Huang, Jianlin (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...conference paper 2024
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Yuan, Cadmus (author), de Jong, S.D.M. (author), van Driel, W.D. (author)The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this backdrop, machine learning technologies emerge as dynamic tools for correlation building and classification, revolutionizing the...conference paper 2024
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de Jong, S.D.M. (author), Ghorbani Ghezeljehmeidan, A. (author), van Driel, W.D. (author)The ability to accurately predict the reliability and lifetime of electronics is of great importance to the industry. The failure of the solder joint is of particular interest for these predictions, because of their susceptibility to failure under thermo-mechanical stress. However, the experimental or even conventional simulation techniques...conference paper 2024
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Li, J. (author), Vollebregt, S. (author), Zhang, Y. (author), Shekhar, A. (author), May, Alexander (author), van Driel, W.D. (author), Zhang, Kouchi (author)Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study models the trap-induced transient current in silicon carbide metal-oxide...conference paper 2024
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Martin, H.A. (author), Xu, Haojia (author), Smits, Edsger C.P. (author), van Driel, W.D. (author), Zhang, Kouchi (author)This study introduces a training protocol utilizing Convolutional Neural Networks (CNNs) and Confocal Scanning Acoustic Microscopy (CSAM) imaging techniques to classify Power Quad Flat No-leads (PQFN) package delamination. The investigation involves empty PQFN packages with varied substrate metallizations subjected to thermal cycling. Four...conference paper 2024
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Inamdar, A.S. (author), Hauck, Torsten (author), van Soestbergen, Michiel (author), van Driel, W.D. (author), Zhang, Kouchi (author)Model order reduction techniques are developed and utilized to make numerical simulations more efficient. The use of Reduce Order Models (ROM) also enables data exchange with external parties without disclosing the sensitive information present in a Full-Order Model (FOM). It is crucial to optimize for both the efficiency and accuracy of a ROM...conference paper 2024
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Tang, Hongyu (author), Shi, Weiqi (author), Zhang, Rongjun (author), Fan, J. (author), Zhang, Kouchi (author)Tungsten disulfide (WS2) has recently attracted considerable attention owing to its excellent physical, chemical, electronic, and optical properties, leading to increased research into its applications in electronic and optoelectronic devices. However, the oxidation of 2D material affects significantly its optical and electronic properties...conference paper 2024