A novel flexible ultrasound neurostimulator featuring a pitch-matched 2D array

Sensor Integration in PV Devices: State of the Art and Future Opportunities

The on-field performance and lifespan of PV modules are affected by the interaction of numerous parameters, among which temperature, strain, and humidity. Among these parameters, only temperature is occasionally measured in PV installations, and such monitoring is often external to the module. This limits its use and does not provide accurate...

Polyimide Encapsulation for Implantable Medical Devices

The application of implantable medical devices (IMDs) is increasing rapidly due to the many health benefits they provide in diagnosing and treating diseases. However, these devices have to be able to survive harsh body conditions to ensure their reliability and functionality. Bodily fluids initiate chemical degradation and corrosion in the...

High-density interconnect technology optimised for flexible implants

Electronic implants are becoming a valuable tool to explore and regulate neural activity, potentially overcoming neural disabilities that are still incurable. On the one hand, neural recording can provide tremendous insight into the neural system and the sometimes accompanied neural diseases. On the other hand, neural stimulation is necessary to...

Polymer Microfabrication Modules for Cytostretch Organ-on-chip Applications

The use of conventional biological assay tools, such as Petri dish, has hindered the drug discovery studies ineffective and time-consuming. To cope with this problem, organ-on-chip (OOC) devices have been developed. Modeling organ functionality, topography, and pathology, OOC devices are expected to pave the way the drug discovery processes....

Irreversible bonding between PI and PDMS for flexible body patches

Wafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration

System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...

Foldable 3D Wafer Level SSL Package Using Flexible Interconnect

Solid State Lighting (SSL) is on track to replace conventional incandescent and fluorescent sources for general lighting. Even though it offers many benefits, the high initial device costs are still a major hindrance for many consumers. Packaging can account for up to half of the total device price, offering high potential for cost reduction. In...

Karakteristieken van de Single Grain Thin Film Transistor op polyimide substraat

Dit onderzoek richt zich op het fabriceren van een passieve sensor op een plastic substraat. Momenteel worden er op het Delft Institute of Microsystems and Nanoelectronics (DIMES) Technology Center nieuwe productietechnieken voor thin-film transistoren (TFT) op polyimide getest waarmee de kosten voor massale productie flink dalen. Deze nieuwe...