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  • (-) subject:"3D\-Stacked"

Collection

  • Institutional Repository (7)

Document type

  • journal article (4)
  • doctoral thesis (3)

Subject

  • frequency scaling (2)
  • manycore (2)
  • process variation (2)
  • voltage scaling (2)
  • voltage selection (2)
  • within-die variation (2)
  • zero-energy (2)
  • 3D memory (1)
  • 3D stacked ICs · through-silicon via · manufacturing test · design-for-test · wrapper · test access mechanism · standardization · IEEE 1149.1 · IEEE 1500 (1)
  • 3D stacked integrated circuits (1)
  • 3D stacked-IC (1)
  • 3D-SICs (1)
  • 3D-Stack (1)
  • 3D-Stacked (1)
  • 3D-stacked ICs (1)
  • 3D-stacked chip (1)
  • NEMFET (1)
  • NEMS (1)
  • Neural Network (1)
  • Simulator (1)
  • dark-silicon (1)
  • dynamic power (1)
  • energy-delay-product (1)
  • idle power (1)
  • low power (1)
  • low-power (1)
  • low-power design (1)
  • memorary redundancy (1)
  • memory hierarchy (1)
  • multicore (1)
  • nemfet (1)
  • nems (1)
  • power management (1)
  • redundancy (1)
  • reliability (1)
  • simulator (1)
  • testing (1)
  • wafer matching (1)
  • yield analysis (1)
  • yiled enhandement (1)
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Author

  • Taouil (4)
  • Hamdioui (3)
  • Majzoub (2)
  • Saleh (2)
  • Ashraf (1)
  • Bamakhrama (1)
  • Chi (1)
  • Enachescu (1)
  • Konijnenburg (1)
  • Lefter (1)
  • Marinissen (1)
  • Verbree (1)
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Date

2011 - 2023
(years)
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Format: 2023/09/24
Searched for: subject%3A%223D%255C-Stacked%22
(1 - 7 of 7)
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Rapid Design-Space Exploration for Low-Power Manycores under Process Variation utilizing Machine Learning
Rapid Design-Space Exploration for Low-Power Manycores under Process Variation utilizing Machine Learning
Energy Optimization for Large-Scale 3D Manycores in the Dark-Silicon Era
Energy Optimization for Large-Scale 3D Manycores in the Dark-Silicon Era
On Leveraging Vertical Proximity in 3D Memory Hierarchies
On Leveraging Vertical Proximity in 3D Memory Hierarchies
Hybrid NEMS-CMOS Architectures for Ultra Low Power Smart Systems
Hybrid NEMS-CMOS Architectures for Ultra Low Power Smart Systems: Architectures for Ultra Low Power Smart Systems
Yield and Cost Analysis or 3D Stacked ICs
Yield and Cost Analysis or 3D Stacked ICs
Yield Improvement for 3D Wafer-to-Wafer Stacked Memories
Yield Improvement for 3D Wafer-to-Wafer Stacked Memories
A DfT architecture for 3D-SICs based on a standardizable die wrapper
A DfT architecture for 3D-SICs based on a standardizable die wrapper
Searched for: subject%3A%223D%255C-Stacked%22
(1 - 7 of 7)
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