A Systematic Performance Evaluation of TCAS II and ACAS Xa

Design of a novel thermocompression bonding module: For high throughput Flex-on-Substrate assembly

Flex-on-substrate assembly is an increasingly popular electronics assembly type that is based on thermocompression bonding: a combination of high temperature and pressure. Currently, up to two-thirds of the cycle time is spent on heating and cooling. To meet the growing demand for flex-on-substrate production in the future, the heating and...