Modelling & Evaluation of EM Effect of Metal Fills used in IC Technology

Nowadays, recent Integrated Circuit Technology demands a minimum metal fill inclusion across the entire die of each functional layer to have uniform planarity. It is challenging to numerically simulate the real structure using Electromagnetic (EM) solvers because the mesh size of an EM solver is inversely proportional to the number of vertices...

Wideband Flat Lenses Based on Artificial Dielectric Layers

Planar lenses based on metasurfaces or resonant elements are typically narrowband due to phase wrapping, which is strongly frequency-dependent. On the contrary, true-time-delay (TTD) planar lenses, which do not resort to phase wrapping, can achieve large bandwidths. One convenient way to design wideband TTD lenses is by means of artificial...

Wideband, Wide-Scan Planar Connected Slot Array Enhanced with Artificial Dielectrics

In this thesis, the design of planar connected array of slots loaded with artificial dielectric layers (ADLs) is proposed to achieve wideband and wide-scan capabilities. ADLs are used due to the potential advantage of low surface-wave loss and high radiation efficiency. Whereas, the connected array of slots avoid the implementation of baluns...

Artificial Dielectric Shields for Integrated Transmission Lines

We present a novel shielding method for on-chip transmission lines built on conductive silicon substrates. The shield consists of an artificial dielectric with a very high in-plane dielectric constant, built from two patterned metal layers isolated by a very thin dielectric film. Inserted below an integrated coplanar transmission line, the...