Searched for: subject:"Adhesive%5C%2Bbonding"
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Schijve, J. (author), Jacobs, F.A. (author)
Fatigue tests were carried out on Redux and FM 123/5 bonded specimens at various stress levels, temperatures (RT to 65 C) and low and high test frequencies. Observations were made on the type of failure (bond line failure or sheet failure) and the significance of the adhesive squeezeout for crack nucleation. An analysis of the data and a...
report 1984